NVIDIA technologies support clinical AI orchestration, runtime security and digital twins across Foxconn’s healthcare ecosystemOctober 2026, Taipei, Taiwan – At Hon Hai Tech Day 2026 (HHTD26), Foxconn’s Smart Healthcare exhibition showcases its vision for AI-driven healthcare across the care continuum, organized around three key areas: AI-Assisted Diagnosis & Digital Twins, Embodied AI, and Smart Healthcare Manufacturing. By integrating AI agents, embodied AI, and multimodal medical models, Foxconn connects clinical decision-making with intelligent devices, hospital workflows, and manufacturing capabilities. The exhibition demonstrates Foxconn’s end-to-end integration expertise, spanning AI software, edge computing, robotics, and healthcare manufacturing to build a comprehensive smart healthcare value chain. Foxconn brings together its ecosystem, real-world deployment environments, products, edge-to-cloud infrastructure, and hardware-software integration. Aligned with NVIDIA’s “Five-Layer Cake” AI strategic framework, this approach connects AI technologies with intelligent medical devices and real clinical environments, advancing healthcare AI from individual proof-of-concept applications toward integrated systems and real-world clinical deployment. CoDoClaw: Advancing from AI Models to Clinical AI Agents As a key highlight of the exhibition, CoDoClaw, Foxconn’s Clinical AI Orchestrator, marks a significant milestone in the evolution from AI models to AI agents. Jointly developed by Foxconn and Tung’s Taichung MetroHarbor Hospital, CoDoClaw focuses on diabetes and cardiometabolic multimorbidity management. By integrating multimodal medical models with agentic AI, it connects data and AI capabilities across specialties and healthcare systems, advancing clinical applications from standalone diagnostic support to cross-specialty decision-making and workflow coordination. Built on NVIDIA NemoClaw open agent blueprint and NVIDIA OpenShell secure runtime software, CoDoClaw is designed to interpret clinical contexts, reason through tasks, and orchestrate AI agents within defined clinical workflows. To address the stringent security requirements of healthcare environments, CoDoClaw integrates centralized security policy management, sandbox isolation, and runtime access controls, alongside NVIDIA Sentryagent identity and delegated authority verification capabilities. Together, these mechanisms strengthen runtime security, mitigate risks such as unauthorized actions, sensitive data exposure, and credential leakage, and establish a trusted foundation for the responsible adoption of autonomous AI agents in clinical settings. Extending AI Clinical Capabilities Across Diverse Healthcare Settings Foxconn is also extending its AI-powered clinical capabilities into a variety of diagnostic and care environments. In the telemedicine zone, CoDoctor EKG Screener, an AI-powered electrocardiogram analysis system, brings real-time cardiovascular risk screening and anomaly alerts beyond hospitals into home-based care, community healthcare, and postoperative monitoring environments. At the endoscopy center, CoDoctor Endovia, an AI-assisted colonoscopy analysis software solution, is jointly developed by Foxconn, Kaohsiung Medical University Chung-Ho Memorial Hospital, YUAN High-Tech, Yuan Yu Industry, By integrating edge AI into endoscopic examination workflows, the solution provides real-time lesion detection, pathological classification, bowel preparation quality monitoring, withdrawal speed analysis, and intraoperative 3D navigation. These capabilities help improve examination quality and diagnostic consistency. Integrated Chemotherapy Compounding and Delivery System A major exhibition highlight is the Integrated Chemotherapy Compounding and Delivery System, developed through collaboration among Foxconn, Taipei Veterans General Hospital, Kawasaki Heavy Industries, Yuyama Manufacturing, and FARobot. The system brings together automated medication compounding, in-hospital logistics, and clinical delivery into an integrated healthcare automation ecosystem. Using NVIDIA Omniverse libraries, Foxconn builds digital twins to simulate and evaluate chemotherapy compounding, robotic transport and delivery workflows before deployment, allowing  high-risk chemotherapy workflows to be simulated, monitored, and continuously optimized. It integrates ChemoRo the Spike automated chemotherapy compounding equipment, FARobot autonomous mobile robots, and Foxconn’s Nurabot nursing collaborative robot to coordinate the entire workflow, from compounding and transportation to distribution and clinical delivery. By connecting these systems into a coordinated, end-to-end workflow, Foxconn aims to enhance medication safety, improve clinical efficiency, and increase operational reliability in complex hospital environments.

·      MODEL A+expands B2B product portfolios in fastest-growing B-segment SUV ·      MODEL K+ SUV playful styling gives nostalgic touches of Japan with neo city pop ·      MODEL Ktaps into kei-class trucks with design language of MODEL T ·      Flexing CDMS strength to accelerate electromobility for automotive clients30 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317) on Friday flexed its contract design and manufacturing service (CDMS) strength for automotive clients by unveiling three new reference electric vehicles aimed at under-penetrated markets, while offering cost competitive options and flexible design platforms. Two eye-catching SUVs, the MODEL A+ and MODEL K+, alongside the MODEL K compact truck, extend Foxconn’s electromobility progress into the kei-class trucks popular in Japan and brings the Group’s EV range to a total of 12 reference models. “The new reference EVs join Foxconn’s emerging ecosystem in electromobility that is accelerating time-to-market, time-to-cost and time-to-technology for our customers and partners,” said Jun Seki, Foxconn Chief Strategy Officer for EV. All three new models were on display at Hon Hai Tech Day 2026 (HHTD26), the flagship annual technology conference of the world’s largest electronics manufacturer and the world premiere stage for the Group’s B2B electric vehicles. On the exhibition floor in Taipei, Foxconn’s electromobility ecosystem included demos of full stack, made in Taiwan battery developments from materials to cells and packs to BMS; E/E architecture; and powertrains for E2W and E3W. Among EVs on display, a right-hand drive MODEL B gave attendees a chance to check out the result of CDMS collaboration, while onstage, Honda R&D and Mitsubishi Electric Mobility discussed, in separate remarks, their electromobility developments with Foxconn. MODEL A+ An expressive luxury style yet authentic SUV for affluent drivers, the MODEL A+ is a deliberate move to expand B2B product portfolios in the fastest-growing B-segment SUV. With In-Wheel Motor technology and selectable EEA, a wild exterior design but ultimate space interior addresses flood capability emergencies, temporary living space and backup power for glamping and camping eletromobility lifestyles.   MODEL K+ This is an expressive yet affordable SUV designed for active youth. Playful styling with nostalgic touches recall Japan’s city pop music era of the ‘70s and ‘80s, but with a neo city pop take for the modern day. The highly distinctive lifestyle SUVfor a niche market targets B2B looking to develop their own brand’s lifestyle SUV EV, as well as OEMs looking to offer affordable yet distinctive vehicles for younger customers. With In-Wheel Motor technology, the MODEL K+ offers personalization of exterior, interior, driving range, and EEA for purpose-built capability at a competitive price. MODEL K This is a functional yet futuristic truck for forward-thinking business owners. Aimed at the specialized commercial kei truck class, the MODEL K finds use as last-mile and mobility service applications. Its alignment to support compliance to environmental regulations makes it attractive for decarbonization-focused entrepreneurs, municipalities, and government agencies while offering lower total cost of ownership (TCO) through reduced energy and maintenance costs.A functional beauty, inspired by the design language of Foxconn’s award-winning MODEL T electric bus, the canopy-ready MODEL K conceptualizes a lower bed height and longer bed length. Other reference EV models to-date: ·      MODEL T large bus ·      MODEL C passenger SUV ·      MODEL E luxury sedan ·      MODEL B crossover SUV ·      MODEL V truck ·      MODEL N cargo van ·      MODEL D LMUV ·      MODEL U midi-bus ·      MODEL A modular B-segment  

·      Flagship annual technology conference held for 7th year, celebrates tech partnerships ·      Record 321 exhibits demonstrate vertical integration and precision manufacturing ·      20-meter long wall shows components to system integration of next-gen AI infra ·      Most embodied intelligence assembled at HHTD2630 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday confirmed its industrial leadership in token factory solutions with an unprecedented look at components and system technologies enabling next generation AI infrastructure and by giving spotlight to its storied partnerships for the first time. At the 7th annual Hon Hai Tech Day 2026 (HHTD26), Foxconn laid bare the world-beating vertical integration and precision manufacturing strengths behind its work on the NVIDIA Vera Rubin platform, from rack-level full AI supercomputing system integration to sub-micron-level component manufacturing technologies. In two firsts, Foxconn showcased NVIDIA DSX POD, a standardized, factory-built reference design that enables partners to preintegrate NVIDIA Vera Rubin rack-scale AI infrastructure in modular containers, complete critical validation before shipment and connect the units to prepared site infrastructure after delivery, dominated the venue and welcomed visitors, while a new customer zone with key moment photos and milestone technology timelines paid homage to behind-the-scenes partnerships that have captured the imagination of the technology industry. “Foxconn is transforming into a technology manufacturing platform service provider,” said Foxconn Chairman Young Liu. “From testing to the tangible, our vertical integration and precision manufacturing makes the impossible possible. We are building this kind of strength across ecosystems of smart consumer electronics to AI and EV, as well as in space and robotics.” Among a record 321 exhibits at HHTD26, a quarter comprised the Token Factory zone. Extreme co-design is a visual tour at a 20-meter long wall exhibiting PCBs mounted with tens of thousands of micron-level precision-engineered components; AI server cable-free, hose-free and fanless compute tray design in a single generation; next AI megatrend co-packaged optics (CPO); and power, cooling and high-speed data solutions re-imagined for more efficient AI infrastructure. An immersive simulated AI data hall demonstrated how AI compute, networking, power and cooling are co-designed for an AI factory, including NVIDIA 800 VDC power distribution. Foxconn’s dedicated business unit for AI supercomputing & cloud operations and an NVIDIA Cloud Partner, Visionbay.ai, is planning its facility design to follow NVIDIA DSX MaxLPS principles to maximize AI factory performance per watt within a fixed power envelope and optimize computing, power and cooling configurations ahead of construction. Onstage, NVIDIA, Google LLC, and Schneider Electric discussed AI infrastructure; Honda R&D Co Ltd and Mitsubishi Electric Mobility discussed next generation electromobility. The most embodied intelligence for HHTD26 assembled in the Robotics and Humanoid zone, showing the potential of a growing ecosystem and demonstrating real-world application examples of industrial products used in robotics. In another first, Foxconn leaned into its rich heritage in ultra-precision manufacturing processes backed by its proprietary machining, materials processing, and mold making equipment with a Precision Manufacturing zone dotted with technologies that have resulted in Poketomo AI companion robots and one-punch enclosures for laptops. Among the exhibits, the importance of AI safety was a common thread as Foxconn teams demonstrated how the NVIDIA Open Agent Safety Platform could support agent safety across smart healthcare, smart manufacturing and robotics, and smart city. HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference launched for the first time a family-friendly pavilion for children to experience hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city. For more on Hon Hai Tech Day 2026 here. About Foxconn here.