Hon Hai Technology Group (“Foxconn”) (TWSE:2317), world’s largest electronics manufacturer and leading technological solutions provider, and Pace CCS, the global leader in carbon capture and storage (CCS) design, today announced a major step in solving a key challenge for the CCS industry. The companies have begun operations at a new laboratory in Taipei to develop a chemical injection unit to prevent corrosion in CCS networks. This partnership combines Foxconn’s expertise in precision manufacturing with Pace CCS’s specialized design knowledge. It demonstrates how cross-industry collaboration can advance the shared goal of fighting climate change. Carbon capture and storage is a critical technology for achieving Net Zero emissions. The global demand for carbon capture is estimated at eight billion metric tons of CO2 annually, requiring trillions of dollars in investment. A key technical challenge is protecting CCS infrastructure from corrosion. Chemical reactions within the CO2 stream can create corrosive products such as sulfuric acid and nitric acid. These reactions can also produce water and solids, which lead to corrosion, erosion, and clogged disposal wells. The new laboratory will prove the efficacy of a chemical scavenger, already used in industries including semiconductor manufacturing. The goal is to show it can prevent the formation of these damaging acids and water under real-world CCS conditions. “This is the solution the CCS industry has been waiting for,” said Matthew Healey, Pace CCS Managing Director. “By turning a major technical challenge into a simple operational expense, we’re accelerating global CCS deployment.” “Foxconn is proud to bring our supply chain expertise to the energy transition,” said Ron R. T. Horng, Foxconn’s Chief Environment Officer. “This collaboration shows how cross-industry partnerships can drive meaningful progress against climate change.”   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   About Pace CCS Pace CCS are the global leaders delivering design for CCS projects, with experience with well over 100 CCS projects worldwide. Pace CCS are based in London and Kuala Lumpur. To learn more, visit www.paceccs.com.

Taipei, Dec. 23, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn) announced that its key automotive electronics product, the Telematics Control Unit (TCU), has successfully passed DEKRA process certification and obtained both ISO 26262 Functional Safety certification and ISO/SAE 21434 Automotive Cybersecurity certification. This milestone places FIH among a limited number of companies in the TCU domain to concurrently obtain both certifications, significantly reinforcing its strategic role in the global automotive electronics supply chain. Aaron Lee, Managing Director of DEKRA Taiwan (right), presented the ISO 26262 and the ISO/SAE 21434 Certifications to Dr. Wen Kuo, Vice President of FIH.  Dr. Wen Kuo, Vice President of FIH, stated, “By implementing ISO 26262 and ISO/SAE 21434, FIH has established a comprehensive safety lifecycle management framework that enables customers to reduce system integration risks, accelerate validation timelines, and meet increasingly stringent regulatory requirements. Backed by our deep expertise in the ICT industry, as well as our capabilities in independent design, high-quality manufacturing, and system integration, FIH is committed to delivering robust, secure, and reliable solutions and becoming a long-term, trusted partner for global automakers.”   As the automotive industry accelerates toward electrification and Software-Defined Vehicles (SDVs), functional safety and cybersecurity have become essential thresholds for global OEMs when evaluating Tier-1 suppliers. ISO 26262 is the internationally recognized standard for automotive functional safety, ensuring that electronic and electrical systems remain controllable under fault conditions. Meanwhile, ISO/SAE 21434 establishes a comprehensive cybersecurity framework for road vehicles, encompassing threat analysis, risk assessment, governance, and lifecycle management. Together, these two standards form a core foundation for smart and connected vehicles and are indispensable to the transition toward autonomous driving and SDVs.   As the communication hub of smart and connected vehicles, the TCU supports functions including remote diagnostics, connected vehicle services, vehicle data transmission, and over-the-air (OTA) updates. Its functional safety and cybersecurity protection levels directly impact the stability and risk management of the entire vehicle system. Through the successful attainment of both ISO 26262 and ISO/SAE 21434 certifications, FIH has demonstrated that its capabilities in hardware design, software architecture, secure communications, and cybersecurity protection meet the rigorous requirements expected by leading global automakers.   As global automotive electronic architectures and Software-Defined Vehicles (SDVs) continue to evolve rapidly, safety and cybersecurity requirements across automakers’ supply chains have become increasingly stringent. “FIH’s ability to complete both certifications within a single year and to its achievement in the TCU domain reflects its strong R&D execution and well-established management systems. This achievement aligns closely with global automakers’ expectations for safety, quality, and cybersecurity and represents a highly meaningful industry milestone. We are pleased to witness this accomplishment together with FIH,” said Aaron Lee, Managing Director of DEKRA Taiwan. FIH’s Automotive Electronics team poses for a group photo with the expert team from DEKRA.About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers.   For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

18 December 2025, Taipei, Taiwan – The Hon Hai Research Institute (HHRI) is pleased to announce the successful completion of Round 1 of the Australian Quantum Software Network (AQSN) Micro & MesoGrant Scheme. In this inaugural round, HHRI, as the key sponsor, awarded more than AUD 150,000 in competitive funding to support early-career and mid-career researchers across Australia in advancing quantum software and algorithmic research. The AQSN MicroGrant / MesoGrant programs are funding schemes designed to support research in quantum algorithms, quantum software, and quantum theory. AQSN members—including students and researchers—may apply. The MicroGrant is suitable for short-term or early-stage open-source projects, while the MesoGrant supports mid-scale or collaborative research efforts. Funded projects typically run for 6–12 months and require outcomes to be open-sourced and publicly shared, fostering collaboration and knowledge exchange within the quantum software community. AQSN founder and Review Committee member Dr. Simon Devitt stated: ”We sincerely appreciate the support from the Hon Hai Research Institute’s Quantum Computing Research Center and the enthusiastic participation of the Australian quantum research community. Congratulations to all the award recipients. HHRI’s generous sponsorship has enabled AQSN to empower the next generation of quantum pioneers and to build a vital bridge between academic excellence and industrial impact. We are honored to collaborate with HHRI in establishing a strong software foundation for the quantum era.” Dr. Min-Hsiu Hsieh, Director of HHRI’s Quantum Computing Research Center, said:“Scientific breakthroughs often originate from a small yet bold idea. At the Hon Hai Research Institute, we are committed to becoming a catalyst for innovation. By supporting AQSN’s young scholars, we hope to inject fresh momentum into the field of quantum computing. This collaborative initiative represents HHRI’s commitment to nurturing the next generation of quantum talent, and we look forward to seeing students and researchers become key forces driving global quantum technology development.” A total of 9 projects were selected, including six MicroGrants and three MesoGrants fully sponsored by HHRI. These projects reflect the depth and creativity of Australia’s quantum research community, ranging from foundational theory to practical algorithmic development. The successful recipients and their project topics are listed below: MesoGrant Recipients 1.       Clément Canonne (University of Sydney) — Towards Understanding Which Quantum Circuits Can Be Classically Sampled 2.       Harini Hapuarachchi (RMIT University) — Towards a Unified Software Toolkit to Simulate Noise in Diamond-Based Room-Temperature Spin Qubits 3.       Angus Southwell (Monash University) — Quantum Gibbs Sampling via Simplicial Complexes MicroGrant Recipients 1.       Jonas Freiheit (RMIT University) — Optimising Encoding & Readout for Quantum Reservoir Computing Based on Quantum Ising Models 2.       Elija Perrier (University of Technology Sydney) — Coherent Learning for Quantum Agents 3.       Abhinash Kumar Roy (Macquarie University) — Resource-Efficient Characterisation of Multi-Time Quantum Processes 4.       Varun Srivastava (Macquarie University) — Randomised Benchmarking as a Diagnostic for Non-Markovian Noise and Fault-Tolerance Thresholds 5.       Mingyu Sun (University of Technology Sydney) — Scalable Fidelity Estimation and Learnability from Local Measurements 6.       Tianhui Zhu (UNSW) — Implementing Virtual Distillation with Quantum Algorithms HHRI extends its gratitude to the AQSN assessment committees and the entire Australian quantum research community for their enthusiastic participation. Congratulations to all awardees. Hon Hai Research Institute remains committed to supporting quantum research and innovation worldwide, fostering academic collaboration, and accelerating the development of next-generation quantum technologies. We look forward to supporting future rounds of this scheme and the exciting research that will emerge as a result. About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy. To learn more, visit https://www.hh-ri.com

Taiwan’s global impact in quantum technology shines in IYQ 202517 December 2025, Taipei, Taiwan – In recognition of his long-standing contributions to advancing quantum research, education, and industry collaboration, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) Board Director Ching-Ray Chang has been selected as an honoree in the global Quantum 100, the flagship initiative in IYQ 2025, the United Nations-designated International Year of Quantum Science and Technology. Professor Chang, who is also Distinguished Chair Professor at Taiwan’s Chung Yuan Christian University and Quantum Technology Advisory Committee Member of the Hon Hai Research Institute, has provided strategic guidance on Foxconn’s quantum technology roadmap and research direction in recent years. His contributions are supporting the Group’s efforts to align its quantum R&D capabilities with the global ecosystem, and its manufacturing capabilities for ion-trap quantum computers. Marking the 100th anniversary of the birth of quantum mechanics, the United Nations General Assembly designated 2025 as the International Year of Quantum Science and Technology (IYQ 2025), with the United Nations Educational, Scientific and Cultural Organization (UNESCO) launching the Quantum 100, a flagship initiative to celebrate the diverse people behind quantum science and technology. Professor Chang has played a central role in building Taiwan’s quantum research and education infrastructure. Authoring more than 280 academic papers and holding over 28 patents, he actively engages in popular science writing and public outreach, making complex quantum concepts accessible and fostering greater societal understanding of quantum technology. Professor Chang previously served as Executive Vice President and Acting President of National Taiwan University (NTU), where he founded the NTU–IBM Quantum Hub, now recognized as one of the most active academic quantum centers in Asia, and put quantum computing into NTU’s formal curriculum. He established a quantum information center at Chung Yuan Christian University (CYCU), led national-level quantum training programs, and pioneered the introduction of quantum education at both high school and university levels, systematically cultivating Taiwan’s next generation of quantum talent. Professor Chang is Founding President of the Taiwan Association of Quantum Computing and Information Technology (TAQCIT), where he helped shape Taiwan’s national quantum technology development roadmap and strengthened coordination across academia, industry, and government, including the Quantum Taiwan Forum, a key platform connecting Taiwan’s semiconductor strengths with the global quantum technology ecosystem.

Las Vegas, Taipei, Dec. 16, 2026 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will participate in CES 2026 from January 6 to 9. Under the theme "Driving the Future of Smart Mobility," FIH will showcase its core automotive electronics solutions, including the latest High-Performance Computing (HPC) platform, In-Vehicle Infotainment (IVI) systems, Advanced Driver Assistance Systems (ADAS), and Telematics Control Units (TCUs).To demonstrate the centralized computing power and system integration capabilities of the HPC platform, FIH will present an interactive demo vehicle that allows visitors to control various car functions via the IVI interface to experience seamless operation.   FIH Vice President Dr. Wen Kuo stated, "The automotive industry has shifted from being primarily mechanical-driven to software-centric, which requires powerful centralized computing performance, software update capabilities, and cybersecurity resilience. With extensive experience in electronics product R&D, manufacturing, and system integration, FIH is well-positioned to provide automotive electronics solutions that align with industry trends, enabling automakers to accelerate transformation and enhance deployment flexibility."   FIH's HPC platform offers several advantages to support automakers in developing Software-Defined Vehicle (SDV):   l   Powerful Centralized Computing Capabilities: In addition to IVI and ADAS integration, the HPC platform also supports body control functions, e.g. window control, seat, light control, etc. The total product cost will be optimized for car OEMs. l   Electrical/Electronic Architecture (E/EA) Optimization: Streamlines the traditional Electronic Control Unit (ECU)-intensive distributed architecture by leveraging Zone Control Unit (ZCU), improving overall system collaboration. l   Accelerated Deployment of Innovative Features: Supports real-time Over-the-Air (OTA) software updates across all systems, helping automakers quickly deploy new features and reduce maintenance costs.   FIH will also present its TCU product line, including the e-Call certified 4G product supplied to a dozen globally renowned auto brands; the 5G variant that supports seamless cloud integration, real-time diagnostics, and high-speed data transmission; and modem-only models customizable for various requirements. In addition, FIH offers a multi-modem, multi-network TCU that enables carmakers to achieve level 4 autonomous driving and remote vehicle operation.   FIH's world-class TCU solutions have obtained ISO 26262 functional safety and ISO/SAE 21434 cybersecurity engineering certifications, as well as compliance with international standards such as ASPICE CL2, UN ECE R155 for cybersecurity, and R156 for software updates, demonstrating FIH’s comprehensive cybersecurity readiness and ensuring safe and reliable large-scale deployment.   In addition to its automotive electronics solutions, FIH will also showcase its self-designed Ku and Ka-band LEO user terminals, which integrate flat-panel phased array antenna system that can be applied to diverse scenarios such as maritime, land mobility, and aviation, supporting customers in deploying next-generation 6G communications.   Leveraging over two decades of experience in wireless communications and ICT, as well as extensive development and integration capabilities in mobile phones and IoT products, FIH continues to deepen its three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics. Through its global footprint and flexible production strategies, FIH aims to create exceptional value for customers worldwide.   Welcome to visit us at Booth No. 4167, West Hall, Las Vegas Convention Center.     CES 2026 FIH Exhibition Information: l   Dates: January 6 to January 9, 2026 (Tuesday to Friday) l   Location: Las Vegas Convention Center, the U.S. l   Booth Number: No.4167 About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers.   For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

11 December 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world's largest electronics manufacturing service provider, has been honored with five Greater China awards recognizing its longstanding commitment to transparent, effective, and insightful communication with investors by the globally renowned IR Impact, formerly known as IR Magazine. Shortlisted as finalist for seven awards, Foxconn took home Best in Sector – Technology, Best Buy-side Management, Best CEO Letter, Best Investor Relations Officer, and Rising Star, making it the most awarded Taiwanese company in the Greater China region for the fifth consecutive year and turning in Foxconn’s strongest performance yet in its history in the IR Impact Awards. Foxconn Vice President and Spokesperson James Wu said, “This year’s awards show that everyone is committed to elevating investor communication and service – from the CEO to our IR leadership to new team members. As a global technology leader, Foxconn not only maintains technological excellence, but also places strong emphasis on investor engagement. Winning these five awards is the greatest affirmation for the Group and our IR team.” Foxconn received the most nominations among the 18 Taiwan companies that were finalists in the Greater China IR Impact Awards. The wins in newly-introduced awards for Best Buy-side Management and Best CEO Letter reflect Foxconn’s strong top-down commitment to timely, high-quality, and insight-driven investor communication. Of note were honors to two IR officers that highlight the Group’s commitment to women in leadership, innovative use of AI in the workplace and deepening IR influence. In the Best Investor Relations Officer category, Senior IR Manager Kristen Fang won the award for the second consecutive year, demonstrating her exceptional professionalism and influence in international capital markets. This is her second global IR individual award this year. IR team member Maggie Tsai was recognized as Rising Star, her first IR Impact recognition, for her focus in transforming IR into a strategic function that enhances both external understanding and internal decision-making via innovative methods such as use of a proprietary AI-powered intelligence hub and pioneering groundbreaking Group Investor Conferences and industry forums. Formerly known as IR Magazine, IR Impact is one of the most influential global platforms in the IR and capital markets community, serving as a key bridge between companies, investors, and the broader market. The IR Impact Awards are among the most authoritative recognitions in the IR field, voted on by institutional investors and analysts to acknowledge excellence in IR communication, transparency, AI adoption, innovation, and corporate governance. In previous years, Foxconn has won IR Impact awards in categories such as Best IR Website, Best Use of Multimedia for IR, Best Investor Event, Best Innovative Shareholder Communication, and Best Use of Technology (Including AI). The IR team continues to leverage diverse communication channels to help investors better understand Foxconn’s value while actively benchmarking global best practices, driving innovation, and enhancing investor services to create greater value for both the company and its shareholders. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

CEO Prince Fahad N. Al Saud: EV Charging Is Core Energy Infrastructure in the AI Era[Dammam, Saudi Arabia — December 8, 2025] FIT Hon Teng (6088.HK), a subsidiary of Hon Hai Technology Group (Foxconn) (TWSE:2317), today announced that Smart Mobility — its joint venture with Saudi-based Saleh Suleiman Alrajhi & Sons — has officially broken ground on a new manufacturing facility at King Salman Energy Park (SPARK) in Dammam. The ceremony marks a new chapter in Saudi Arabia’s journey toward localized production of EV charging infrastructure. The ceremony opened with remarks by Mishal I. Al-Zughaibi, President and CEO of SPARK. He noted that SPARK is steadily developing into a leading hub for advanced energy and industrial technologies in the Middle East. Located close to Saudi Arabia’s core energy infrastructure, SPARK offers a mature logistics ecosystem and proximity to Arabian Gulf ports. In the future, it will also connect to the GCC railway network, positioning it as a strategically important base for regional manufacturing, exports, and energy technology innovation. Smart Mobility has also installed its high-quality chargers serving as the park’s first EV charging station. This not only demonstrates its technological capabilities, but also underscores Smart Mobility’s role as a key enabler in the transformation of the energy park. In his remarks, Smart Mobility CEO Prince Fahad N. Al Saud noted that while low fuel prices are often cited as a challenge to EV adoption in Saudi Arabia, the Kingdom’s ambition to become the future energy hub for AI is a clear national vision. Globally, the automotive sector is rapidly transitioning toward AI-driven smart mobility. Whether in Level 4 autonomous driving, vehicle connectivity, or AI-based predictive systems, these capabilities all rely fundamentally on electrification. Prince Fahad emphasized that EVs are not merely a for traditional fuel cars, but the essential computing platform for automotive advancement in the AI era. If Saudi Arabia aims to lead in AI, smart cities, and automation, EV charging networks must be regarded as part of the national energy infrastructure. SPARK, rooted in the energy sector, is the ideal base to support this transition. SPARK is wholly owned by Saudi Aramco, one of the world’s top-ten companies by market capitalization and recognized for its rigorous governance, transparency, and engineering excellence. SPARK’s governance standards, engineering protocols, and compliance frameworks are highly aligned with FIT’s global manufacturing systems, providing a solid foundation for precision manufacturing and future capacity expansion. In addition, SPARK’s geographic advantages enhance the competitiveness of Saudi-made products across the region, enabling EV charging equipment manufactured in the Kingdom to access GCC markets more efficiently through the GCC customs union, cross-border logistics, and the future GCC railway network. FIT Chairman Sidney Lu stated in his remarks that the establishment of the Saudi factory represents not justa manufacturing site for FIT, but a long-term commitment to the Kingdom’s industrial development. The creation of Smart Mobility and today’s groundbreaking ceremony are built on mutual trust and collaboration with joint-venture partner Saleh Suleiman Alrajhi & Sons. They also reflect CEO Prince Fahad’s clear strategic vision and steadfast leadership, which have been crucial in bringing the project to fruition. He added that support from the Ministry of Energy and other relevant authorities throughout the SPARK site-selection process significantly was significantly helpful to the project. Chairman Lu highlighted that FIT operates factories and R&D centers across Asia, Europe, and the Americas, and also automotive production lines in Africa serving European markets — experience that equips the company to build highly reliable, cross-regional manufacturing networks. For the new Saudi facility, it represents FIT establishing an important footprint in EMEA: Saudi Arabia is not merely seeking overseas manufacturing capacity, but is inviting global technology partners to help shape the next chapter of its energy and industrial future. For FIT, this factory represents not only an asset but a commitment — a long-term partnership, shared vision, and mutual commitment to progress. The groundbreaking ceremony also aligns with the “Saudi Made” program promoted by the Local Content and Government Procurement Authority, which requires government procurement to prioritize locally manufactured products. The Smart Mobility plant will produce multiple EV charging hardware models, supported by a Charging Point Management System (CPMS) that has undergone more than six months of field testing in Saudi Arabia. Together, these developments will strengthen the Kingdom’s local supply chain and support deployments across public and commercial sectors. The ceremony also welcomed two key Public Investment Fund (PIF)–backed organizations: EVIQ (EV Infrastructure Company) and NAVA (National Automotive and Vehicles Academy), demonstrating strong governmental commitment and cross-agency support for accelerating EV infrastructure. Smart Mobility announced that three EV charging products have received SASO certification, and its CPMS is expected to begin commercial operation in the first half of 2026. The 9,490-square-meter facility is scheduled for completion in the third quarter of 2026 and, following SPARK’s required verification processes, will begin the production in the fourth quarter.

26 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) has been recognized with two Silver Awards – Asia’s Best Sustainability Report (Large Company) and Asia’s Best Supply Chain Reporting – at the 11th Asia Sustainability Reporting Awards (ASRA). These accolades highlight Foxconn’s dedication to high-quality sustainability disclosure and its ongoing efforts to advance sustainable supply chain management, demonstrating the company’s commitment to transparency and accountability in managing environmental, social, and governance (ESG) priorities. Guided by its principle of “Always Better,” Foxconn’s 2024 Sustainability Report and Supplier Responsibility Report achieved significant improvements in both the breadth and depth of their disclosures. Making its debut at the ASRA, the company earned dual Silver Awards, reflecting the comprehensive, mature, and globally aligned nature of its sustainability reporting practices. Rajesh Chhabara, Founder of the Asia Sustainability Reporting Awards and Managing Director of CSRWorks, stated: “We commend Hon Hai for demonstrating excellence in sustainability reporting and for embracing transparency as a cornerstone of responsible business. Their report reflects a deep understanding of how sustainability performance connects to long-term value creation and stakeholder trust.” The Asia Sustainability Reporting Awards (ASRA) is the region’s most respected platform for recognizing excellence in sustainability reporting. The rigorous multi-stage evaluation process includes comprehensive assessments, peer reviews, and stakeholder reputation checks to identify the best reports across multiple award categories. The 11th edition of ASRA brought together leading companies from 17 countries, representing diverse industries and reporting frameworks. Each entry was evaluated for clarity, credibility, completeness, and alignment with international best practices such as the GRI Standards, ISSB Standards, and TCFD recommendations. Highlights of Foxonn’s Sustainability and Supplier Responsibility Reports Sustainability Report ·      Adoption of double materiality assessment to identify key topics and their positive and negative impacts. ·      Verification level upgraded to Type 2 Moderate Assurance. ·      First-time disclosure of climate alignment and just transition commitments. ·      Use of renewable electricity reached 67.38%. Supplier Responsibility Report ·      Inclusion of three new international regulations or indicators (CSDDD, BRSR, and Vietnam’s Corporate Governance Code), referencing 24 key domestic and global sustainability frameworks, indices, and goals for a comprehensive 360-degree assessment of disclosures. ·      Expansion of reporting boundary to include labor service procurement. ·      Extended coverage to operations in India and Vietnam. ·      Enhanced disclosure of human rights-related information. Foxconn will continue to strengthen sustainability-related reporting to improve risk and strategy management, communicate progress transparently to stakeholders, build investor confidence, enhance brand reputation, and create long-term competitive advantage in global markets.   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com  

Project will create nearly 1,400 new jobs, meet growing demand for data servers 26 November 2025, Taipei, Taiwan and Mount Pleasant, Wisconsin – Hon Hai Technology Group (Foxconn) (TWSE:2317) will broaden its investment in Wisconsin to artificial intelligence infrastructure, the backbone of the AI industrial build-out in the United States, following a nod by the Wisconsin Economic Development Corporation (WEDC) that paves the way for nearly 1,400 new jobs over the next four years in Racine County. The world’s largest electronic manufacturing service provider is expanding its Wisconsin manufacturing footprint to meet rising demand from US customers and strengthen domestic supply chains for advancing innovation in data management and resilient, next- generation technological capabilities for the future. “WEDC has been committed to ensuring Foxconn’s success and growth in our state,” said Sam Rikkers, deputy secretary and chief operating officer of WEDC, the state’s leading economic development organization. “This new amendment reflects Foxconn’s status as one of the many leading global manufacturers that have chosen to grow in Wisconsin.” “As the demand for more data infrastructure continues to rise, Foxconn will keep responding to our customers’ needs with flexibility and at scale in the United States,” said Jerry Hsiao, Foxconn’s Chief Product Officer and General Manager of Hon Hai USA. “Wisconsin accounts for close to a fourth of our workforce in America, and this second- stage project will double that presence in the state by the end of this decade.” The WEDC Board of Directors approved the company’s plans to invest an additional $569 million to expand its operations in Racine County, which will create 1,374 new jobs over the next four years. As part of the contract amendment, WEDC will provide up to $16 million in additional performance-based tax incentives to Foxconn, from the first-stage investment that was revised in 2021. With this new expansion, Foxconn is eligible to earn up to a total of $96 million in performance-based tax credits under the state’s Electronics, Information Technology, and Manufacturing Zone (EITMZ) program through Dec. 31, 2029. Under the amended contract, the company will create a total of 2,616 jobs and make a total of $1.2 billion in capital investments during that period. This is Foxconn’s second contract amendment with WEDC. In 2021, the company and WEDC approved an amendment enabling Foxconn to earn up to $80 million in EITMZ credits by the end of 2025 based on the company’s planned investment of $672 million and creation of 1,454 jobs by Dec. 31, 2025, which Foxconn is on track to do. Foxconn leads the global server market, underpinning everyday digital services – from streaming and online shopping to digital banking and smart devices – by providing secure, scalable data server products infrastructure. Foxconn has spent over $2 billion in Wisconsin over the last several years across payroll, capital expenditures, and taxes, creating approximately 1,500 jobs in data server production and reinforcing the state’s position as a leading hub for advanced manufacturing and secure, high-capacity data infrastructure.About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com