Hong Kong –  October 17, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers. At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads. Key product highlights include: - 224G+ sockets for XPU/GPU connectivity - Co-packaged copper and optical architectures - Power cables for ORV3 - Active Optical Cables (AOC) - OSFP1600 and QSFP-DD port configurations These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers. In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers. By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions. About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com Media Contact: Email: fit-ir@fit-foxconn.com   Product and Service Inquiries: Europe and America Contact: sales-usa@fit-foxconn.com       

Imec invites the global automotive ecosystem to join its effort to mutually explore the opportunities presented by chiplet technology LEUVEN (Belgium), October 10, 2024 — Today, at an exclusive gathering in Detroit, bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP). The program brings together stakeholders from across the automotive ecosystem in a pre-competitive research effort unparalleled in the car manufacturing industry. The program’s goal is to evaluate which chiplet architectures and packaging technologies are best suited to support car manufacturers' specific high-performance computing and strict safety requirements, while striving to extend the benefits of chiplet technology – such as increased flexibility, improved performance and cost savings – to the entire automotive industry.  Car makers have been integrating chip technology into their vehicles since the late 1970s. Lately, however, traditional chip architectures have struggled to meet the requirements of ever more demanding automotive solutions, such as advanced driver assistance systems (ADAS) and immersive in-vehicle infotainment (IVI) services. Enter chiplets – i.e., modular chips that are specifically designed to perform specialized functions efficiently and can be seamlessly combined to create more sophisticated compute systems. “The adoption of chiplet technology would signal a disruptive shift in central vehicle computer design, offering distinct advantages over traditional monolithic approaches. Chiplets facilitate rapid customization and upgrades, while reducing development time and costs,” explained Bart Placklé, vice-president of automotive technologies at imec. “However, moving to a chiplet architecture is prohibitively expensive for OEMs if done in isolation. Commercial viability thus hinges on industry alignment around a set of chiplet standards, enabling car manufacturers to procure chiplets from the market and integrate them with proprietary chiplets to build unique offerings.” In search of a chiplet architecture that combines performance, energy efficiency, robustness, cost effectiveness and customization Companies developing supercomputing, data center and smartphone solutions have long explored the benefits of chiplet technology to meet their rapidly increasing computing needs. But the automotive industry has been somewhat more reluctant to embrace the chiplet paradigm due to the unique challenges they face. First, automotive solutions must meet strict robustness and reliability requirements, ensuring continuous operation and passenger safety over a car's typical lifespan of ten to fifteen years. Moreover, cost is another crucial factor to consider. And, finally, superior performance and exceptional energy efficiency are critical to preserving a car's battery life. These are some of the urgent issues imec's Automotive Chiplet Program will address.  A pre-competitive, collaborative research effort unparalleled in the automotive industry Imec’s Automotive Chiplet Program leverages imec’s world-leading track record in advanced 2.5D and 3D packaging with resources and expertise from different parts of the automotive value chain. Bart Placklé: “The agility of chiplets will allow the automotive ecosystem to respond quickly to changing market demands and technological breakthroughs. They also facilitate flexible component integration, limiting the risk of vendor lock-in and improving supply chain resilience. In addition, their optimized performance leads to lower power requirements, enabling compact device design.” “We are convinced that all stakeholders will gain important insights from the program’s pre-competitive, collaborative approach – leveraging the partners’ collective wisdom and means to make rapid progress.  The valuable precompetitive learnings from the program can be instantiated in further R&D and product innovation to accelerate the partners’ own differentiating, long-term roadmaps. In fact, this methodology mirrors the successful practices established in the semiconductor industry over the past four decades. With 40 years of experience in designing, building, and optimizing chip architectures and technologies, and without allegiance to any stakeholder in the automotive ecosystem, imec is uniquely positioned to guide the car manufacturing industry towards the development of a groundbreaking new chiplet architecture tailored to the sector’s specific needs,” he concluded.   About imec Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2023, imec's revenue (P&L) totaled 941 million euro. Further information on imec can be found at www.imec-int.com.   Imec is a registered trademark for the activities of imec International (IMEC International, a legal entity set up under Belgian law as a “stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland supported by the Dutch Government),  imec Taiwan (IMEC Taiwan Co.), imec China (IMEC Microelectronics (Shanghai) Co. Ltd.), imec India (IMEC India Private Limited), imec San Francisco (IMEC Inc.) and imec Florida (IMEC USA Nanoelectronics Design Center Inc.).

Vietnam's 1st Lighthouse Factory, China Achieves 1st Sustainable Lighthouse Certification 11 October 2024, Taipei, Taiwan – The World Economic Forum (WEF) has recognized two more Hon Hai Technology Group (“Foxconn”) (TWSE:2317) facilities as Lighthouse factories. Subsidiary Foxconn Industrial Internet's Bac Giang Province facility becomes Vietnam's first Lighthouse factory, while the Guanlan factory in Shenzhen, China, is certified as Foxconn's first Sustainable Lighthouse. These additions bring the Group's total Lighthouse factories to eight*, underscoring the smart and sustainable leadership of the world’s largest electronics manufacturing service provider. The Vietnam and China factories, recognized by the WEF, showcase the compatibility of efficient manufacturing and sustainability. Through AI and digitalization, these facilities boost production efficiency while reducing environmental impact. This model will be implemented across Foxconn's global base, advancing smart manufacturing and supporting industry-wide digital transformation. Kiva Allgood, Head of the World Economic Forum's Centre for Advanced Manufacturing and Supply Chains, highlighted the significance of these developments: "These sites are integrating advanced technologies into their operations, not just to enhance productivity, but to create a sustainable and inclusive future for their workforce and the broader community." AI and Vietnam's First National Smart Lighthouse Factory The Vietnam factory, now the country's first national Lighthouse factory, provides valuable insights for multinational companies in global deployment. WEF's evaluation noted: “In its global expansion for supply chain resilience, Fii Vietnam overcame initial challenges such as heavy reliance on imported materials and [met] the opportunity to develop local talent. By implementing 40+ 4IR use cases, including advanced planning and AI-driven automation, the site improved labour productivity by 190%, achieved 99.5% on-time delivery and cut manufacturing costs by 45%..." Vietnam's first WEF Lighthouse factory integrates AI, IoT, and big data for end-to-end management, boosting efficiency. Five key technologies enable a flexible production model, addressing cross-border challenges and meeting global demands for diverse, small-batch production. Michael Wang, Vietnam factory's strategy development manager, emphasized that Lighthouse factories primarily enhance operational resilience. By building an interconnected system domestically and internationally, companies can quickly adapt to various setups, improve global supply chain management and production efficiency, and effectively address challenges in multinational operations. AI and the First Sustainable Lighthouse Factory WEF states: "To meet the consumer electronics industry's commitment to carbon neutrality, Foxconn Industrial Internet Shenzhen utilized AI, Internet of Things (IoT) and other 4IR technologies to optimize recycling, track carbon footprints and innovate for sustainability. This led to a 42% reduction in Scope 3 emissions, a 24% cut in Scope 1 and 2 emissions, and increased recycled material content to 55%-75%." Wu Yanru, the sustainable Lighthouse project lead, emphasized that advanced technologies balance production quality with sustainability. For example, AI applications in anodizing ensure both operational efficiency and environmental management. AI-driven innovation is now central to Foxconn's sustainability strategy. The Guanlan factory's advanced implementations, including IoT-supported carbon footprint optimization and AI-driven circular processes, have become valuable tools for improving quality, efficiency, and reducing emissions across various production lines.   About Foxconn here.   *Note: The "Lighthouse Factory" designation is conferred by the World Economic Forum (WEF) through a rigorous selection process based on multiple indicators. Selected factories represent the pinnacle of global smart manufacturing and digital operations. The Vietnam and Guanlan factories join Foxconn Technology Group's existing Lighthouse factories: Shenzhen Longhua (2019/01), Zhengzhou (2021/09), Wuhan (2019/09), Chengdu (2021/03), Shenzhen Guanlan (2023/01), and Taoyuan Nanqing Factory (2023/12).

Strong partnerships evident in Foxconn’s 3 smart platforms, clean energy, space 8 October 2024, Taipei, Taiwan – Artificial intelligence was a running theme through Hon Hai Tech Day 2024 on Tuesday as Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) opened its fifth annual flagship technology conference that displayed the first mass-production-ready NVIDIA GB200 NVL72 platform and took to the stage with a slate of partners to demonstrate the space and clean energy ambitions of the world’s largest manufacturing service provider. Foxconn’s three intelligent platforms – smart manufacturing, smart EV, smart city – received prominent play as keynote speakers in the first day of HHTD24 ranged from leaders such as NVIDIA, Siemens, Bill Gates-backed Breakthrough Energy, GE Vernova from what was formerly General Electric, and one of Europe’s largest space companies, Thales Alenia Space. At the same time, two new reference designs of electric vehicles were unveiled, extending the range of EV models launched since 2021 to a lifestyle multipurpose utility vehicle (LMUV) and a midi electric bus. “A.I. has accelerated our imagination,” said Foxconn Chairman Young Liu to a packed conference of over 2,000 guests, a record. “This acceleration is coming as Foxconn is transforming. We are re-defining ourselves with our three smart platforms. A.I. is driving our transformation, not for the sake of A.I., but because it makes business sense for Foxconn.” Deepu Talla, Vice President of Robotics and Edge Computing for NVIDIA, and Benjamin Ting, Senior Vice President for Cloud Enterprise Solutions Business Group at Foxconn, spoke the companies’ strong partnership in AI. With NVIDIA, Foxconn is not only applying Omniverse and AI to enhance its own factories of the future, but also manufacturing energy-efficient AI systems for its customers, including the world’s fastest AI server and rack systems featuring NVIDIA Blackwell.   The Kaohsiung Super Computing Center was a particular spotlight. Both partners also elaborated on Foxconn’s build out of the world’s largest AI server factory being constructed in Mexico, at more than 400 meters in size, for key customers. Software, robotics and automation are the genesis of factories of the future, while clean energy means collaborating with like-minded partners to pioneer new technologies, be it in ecosystems for electric vehicles or in energy storage systems (ESS). The on-stage conversations and keynotes also pointed to Foxconn’s collaborations to industrialize space to enhance connectivity on the ground. Partners who shared insights for the morning session also included Intrinsic, part of Google-parent Alphabet; consulting leader BCG; US battery technology firm Our Next Energy; and renowned Italian design house Pininfarina. The debut of the MODEL D, as a LMUV, combines the advantages found in SUV and MPV segments. Its styling design was jointly developed with Pininfarina, infusing a sense of harmony to the family of electric vehicles that have been a collaborative work of the Italian and Taiwanese bellwethers. The MODEL U is universal and intelligent in midi size mobility. The sleek reference design of the midi electric bus continues the innovative design language of the award-winning MODEL T full-sized e-bus launched by Foxconn in 2021. The MODEL U’s internal space can be configured according to needs and with its advanced electronic control system and ADAS system, make the driving experience safer and more comfortable. The latest models, including the first variant for the MODEL C tailored for the North American market, highlight the range and maturity of Foxconn’s contract design and manufacturing service (CDMS) business model for automotive B2B customers. The second day of Hon Hai Tech Day, opening to the general public for the first time, is expected to receive more than 8,000 visitors. For more on Hon Hai Tech Day 2024 here. About Foxconn here.

MODEL C, after AXCR debut and first variant, highlights CDMS strength 8 October 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE: 2317), the world's largest technology manufacturer and service provider, announced two, new reference electric vehicles at the fifth annual Hon Hai Tech Day (HHTD), extending its automotive range with the MODEL D, a lifestyle multipurpose utility vehicle, and the MODEL U, a midi-sized electric bus. At the same time, Foxtron Vehicle Technologies, the publicly-listed Foxconn subsidiary responsible for the newly unveiled reference designs, also showcased the first variant of the MODEL C for automotive OEM customers interested in the North American market.   “The latest models join a terrific line-up of EVs displaying our range and maturity in automotive development,” said Young Liu, Chairman of Hon Hai Technology Group (Foxconn). “The EVs going to market with our B2B customers are standing up to real tests in automotive endurance, safety and reliability.” MODEL D is Lifestyle Multipurpose Utility Vehicle The MODEL D is based on the design concept of LMUV (Lifestyle Multipurpose Utility Vehicle) and combines the advantages found in SUV and MPV segments. It is a multi-functional hybrid model and adopts Foxconn’s latest generation platform technology. The MODEL D is 5.2 meters long and has a wheelbase of 3.2 meters, providing a spacious and comfortable seating space. It is equipped with a pneumatic suspension system to improve driving stability. The active suspension allows the height to be adjusted by 15 mm to 25 mm. The body design incorporates S-ducts and air curtains specially designed to reduce wind resistance, bringing the drag coefficient to a low 0.23. The MODEL D’s styling design was jointly developed with renowned Italian design house Pininfarina SpA, infusing a sense of harmony to the family of electric vehicles that have been a collaborative work of the Italian and Taiwanese bellwethers. MODEL U is universal and intelligent in midi size mobility The MODEL U, a new, midi-sized electric bus, continues the innovative design language of the award-winning MODEL T full-sized electric bus launched by Foxconn in 2021. Specially designed for narrow urban lanes and remote areas, the MODEL U’s clean and simple appearance with large windows also emphasizes flexibility and multi-functionality. The body size is moderate, and the internal space can be configured according to needs. Its advanced electronic control system and ADAS system make the driving experience safer and more comfortable. At the same time, the car body structure and aerodynamic design are optimized to achieve longer endurance. MODEL C highlights CDMS capabilities for North American market On Hon Hai Tech Day, the North American variant of the MODEL C, created in cooperation with American partners, was officially unveiled and is expected to be in mass production by the end of 2025. It maintains a simple and fashionable new-generation family style, expanding the S-duct design, new styling and steering wheel, and launching a new user interface (UI) design. The MODEL C, a family SUV that first debuted in 2021, has become one of the best-selling passenger EVs in the Taiwan market following uptake as the “n7” brand of Taiwanese customer Luxgen. In August, the MODEL C was souped up for success as the first ever EV entrant in the 2,100 km Asia Cross Country Rally (AXCR), which is Southeast Asia’s largest motorsport rally. The achievements of the MODEL C are a testament to Foxconn’s Contract Design and Manufacturing Service (CDMS) business model that invites automotive OEM customers to choose their favorite reference designs to customize their cars. Under the modular platform, hardware modules are flexibly combined and the software-defined EE architecture is continuously updated to improve the user experience through software updates.

⚫️A total of 40m axle sets globally produced since 1994 ⚫️A total of 7.9m axle sets produced in China since 2003 ⚫️Shenyang Tiexi Plant will be put into use in 2025 ⚫️Continuous growth prospects through strong order intake and outsourcing trend ⚫️Global sales increase expected from actual US Dollar 4.4 bn (Euro 4bn) to 8.8 bn (Euro 8bn) in 2029 29.08.2024 Osnabrueck # The global automotive supplier ZF Foxconn Chassis Modules (ZFFCN) expects to double its annual sales from actual US Dollar 4.4bn to US Dollar 8.8bn until 2029. Contrary to the situational decline in the global automotive market, ZFFCN is benefiting from a strong order intake of top tier OEM also for its China-based plants and ongoing outsourcing trends. Now, Tiexi plant will put into use in 2025 for additional volume production. Meanwhile, ZFFCN celebrates 30 years of chassis modules excellence in all its 25 international locations. Today ZFFCN looks back on 30 years of axle modules assembly. The supplier legacy of the 50-50 joint venture between ZF Friedrichshafen AG and Foxconn (Hon Hai Technology Group) traces back to August 1994, when the first axle sets left the plant in Duncan (USA) towards customer BMW. Since then, the customer proximity, logistics, and assembly expertise are valued through long-lasting partnerships with the world’s leading OEM such as BMW, Mercedes-Benz, Stellantis, and Jaguar Land Rover. Eike Dorff, CEO of ZF Foxconn Chassis Modules explains:“Today we have two good reasons to celebrate. Firstly, for thirty years our valued teams around the world have proven that our chassis modules expertise is market-leading. Experience, adaptability, unconditional customer focus, and passion remain our guarantors for the client’s success. We are very grateful for our customers, partners, and shareholders for their trust in us. And secondly, Iam very content, that our recent strong order intake leads to long-term business growth for our Chinese business and attracts new customers.” Dr. Xu Jun, ZF Foxconn Chassis Modules China Vice President adds: “Celebrating 30 years of chassis modules excellence overall and 21 years of successful axle systems business in China, is a remarkable testament to the loyalty of our customers and the hard work of our team. I am really happy to celebrate this achievement today and feel grateful for all partners accompanying our success story in China. With great pride and excitement our team is looking forward to several new contracts and the erection of a brand-new plant in China.” Growth perspective in China: New plant in Tiexi district and new car models Additionally to the 2 existing axle module production for 11 different car models from 2 top tier OEM in Shenyang and Beijing plants, ZFFCN will start the production of front and rear axle sets for a new platform in 2026 at Beijing plant. Furthermore, the existing ZFFCN Shenyang plant is expected to start production of an additional, completely new vehicle platform by the year 2028 in a larger volume. Meanwhile the new plant in Tiexi District will start operations in 2025 for additional volume production. Business Excellence for renown and disruptive customers With an unparalleled quality management, agile JIT/JIS processes, and a technology-open approach, ZFFCN plans to evolve its region’s services to attract new customers especially from China’s vast New Electric Vehicle (NEV) portfolio. ZFFCN’s Taiwanese shareholder Foxconn provides additional market proximity and technology know-how throughout the whole AP region. Technology-open approach ZFFCN strives to be at the fore front of the automotive industry, leveraging its expertise in logistics, operations, industrialization, and engineering to deliver added value to a variety of different customers. Many years of portfolio experience and adaptability enable ZFFCN to support its customers globally in a technology-open manner offering services for Combustion Engine (ICE), Hybrid or Fully Electric/ Battery Electric (BEV) vehicles. Visual: ZFFCN_PI_Chassis Modules Production_Logistics   About ZF Foxconn ZF Foxconn Chassis Modules is a 50-50 joint venture between ZF Friedrichshafen AG and Foxconn (Hon Hai Technology Group), founded in 2024. With its 25 locations and 3,600 employees worldwide, the actual company stems from a former ZF product line and therefore can draw on 30 years of experience in the field of axle system assembly in a Just in Time/Just in Sequence (JIT/JIS) environment. ZFFCN ensures a global tailor-made full- service approach for the automotive industry by committing to agile project management and close customer proximity. The joint venture provides industrialization, supply chain management, supplier development, and highly integrated assembly operations on global level. For more information about the ZF Foxconn: Corporate website: Home - ZF Foxconn (zffcn.com)

Frankfurt, Taipei, Sep. 5, 2024 -- FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will participate in the world's leading trade fair for the automotive service industry- Automechanika Frankfurt (AMF) 2024 from September 10 to September 14. FIH will unveil its automotive electronic solutions including 4G and 5G Telematics Control Units (TCU), In-Vehicle Infotainment (IVI) system, Smart Cockpit, Advanced Driver Assistance System (ADAS), Zonal Control Unit (ZCU), Power Distribution Center (PDC). As a leading company in the Information and Communications Technology (ICT) industry, FIH has been specially invited to deliver a keynote speech at the "Innovation4Mobility" forum this year. FIH Vice President Dr. Wen Kuo will share how, in the wave of Software-Defined Vehicle (SDV), the ecosystem and supply chain landscape of the traditional automotive industry will be fundamentally transformed, much like how smartphones overturned the entire mobile phones industry. Additionally, he will elaborate on how FIH can rapidly enter the automotive market and successfully apply this expertise to the automotive ecosystem by leveraging years of development and hardware-software integration experience in the ICT field. Dr. Kuo indicates: "Our extensive automotive electronic products exhibited this time integrate core technologies such as wireless communication, cybersecurity, over-the-air (OTA) updates, computing, sensing, in-vehicle information, human-machine interface, and cloud services. This demonstrates FIH's independent design and high-quality manufacturing capabilities in automotive electronic solutions. In the new era of SDV, we see boundless opportunities and endless possibilities for the integration of ICT and the traditional automotive industry. In the future, we look forward to having more in-depth cooperation with global partners to jointly promote the intelligent and electric transformation of the automotive industry." In addition, FIH has also been invited to speak at the "AMF Taiwan Pavilion". Danny Huang, Business Director of FIH's Mobile Vehicle Solution Business Unit, explains: "Taiwan has long played an indispensable and important role in the global electronics industry chain. At this critical time when the automotive industry and its supply chain are undergoing transformation, FIH will not only showcase our technological advantages through this sharing but also explore cooperation opportunities through experience exchange, working hand in hand with Taiwanese manufacturers to explore international markets." In recent years, FIH has actively developed a "2+2" strategy, focusing on emerging industries and technologies such as "automotive electronics, robotics, artificial intelligence, and next-generation communications". In the field of automotive electronics, FIH has quickly entered the market with its excellent communication technology strength and hardware-software integration capabilities. FIH has automotive product production lines with sufficient capacity in multiple countries including Vietnam, Mexico, India, and China. Through global footprint and flexible production strategies, FIH can make real-time dynamic adjustments according to customer needs, meeting the demands of different markets and creating the most competitive automotive electronic solutions for customers. Welcome to visit us at Hall 4.1 E58 at the Frankfurt Exhibition Center in Germany. 2024 Automechanika Frankfurt https://automechanika.messefrankfurt.com/frankfurt/en.html FIH Exhibition Information: ⚫️Dates: September 10 to September 14, 2024 (Tuesday to Saturday) ⚫️Location: Frankfurt Exhibition Center, Germany ⚫️Booth Number: Hall 4.1 E58 FIH Keynote Information: ⚫️Keynote Topic: Over-the-Air Updates: Upgrading and Monitoring Your Vehicle with Technology Borrowed from Smartphones for Smart Cars ⚫️ Time: September 12, 2024, 2:30 PM to 3:00 PM local time (UTC/GMT +2) ⚫️ Location: Frankfurt Exhibition Center, Hall 3   About FIH Mobile Limited FIH Mobile Limited was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Stock Code: 2038.HK). As a subsidiary of Hon Hai Technology Group (Foxconn), FIH Mobile Limited is a leading manufacturer in the global mobile device industry, with over 20 years of experience in integrated hardware and software design and manufacturing across diverse fields such as mobile phones, tablets, smart wearables, smart speakers, and other wireless communication devices and consumer electronics products. In recent years, FIH has been actively developing its “2+2” strategy, leveraging its core capabilities in hardware and software to expand into fields such as automotive electronics, robotics, artificial intelligence, and next-generation communication technologies, achieving significant progress and results. For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

“Hon Hai Sustainable Monitoring Platform” embodies innovative spirit at Group’s 50-year mark 2 September 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its proprietary platform that can intelligently track sustainability progress at the world’s largest electronics manufacturing service provider has won a Red Dot Award, one of the biggest creative competitions in the world. The “Hon Hai Sustainable Monitoring Platform”, which received a Red Dot Award: Brands & Communication Design, became operational in late 2023 with a user-friendly and compelling interface that belie the complex proprietary technology used to build it. It is instrumental in providing real-time snapshots of how Foxconn is tracking on a company-wide basis against its green goals that align to UN SDGs commitments. The origins of the Red Dot Design Award date back to 1955. Its distinction, the Red Dot, is established internationally as one of the most sought-after quality marks for good design. From products, brand communication and creative projects to design concepts and prototypes, the Red Dot Award documents the most prominent trends worldwide.  “Being recognized with a Red Dot is a fitting milestone for Foxconn on our 50th anniversary this year. We are innovating with information technology capabilities to do our sustainability work better,” Foxconn Vice President and Spokesperson James Wu said. The Star Wars-like, at-a-glance dashboard design of the “Hon Hai Sustainable Monitoring Platform” emphasizes user experience, utilizing dynamic simulation effects and vivid imagery to translate complex ESG data into clear and understandable graphical representations. This greatly enhances the readability and attractiveness of the information, facilitating the understanding and application of data, making it an important support tool for internal corporate decision-making. The custom-made, secure platform can intelligently aggregate data from Foxconn's 205 locations across 24 countries, enabling management to track the real-time progress of ESG goals in each region. Through intelligent analysis, it provides deep insights into each unit's ESG performance and offers timely support to ensure the achievement of ESG objectives. About Red Dot Award: Brands & Communication Design here.