TECO Electric & Machinery Co. (1504) returns to Hon Hai Tech Day today (October 30) for the second year, highlighting their collaboration with Foxconn  on a Modular Data Center (MDC) concept based on the NVIDIA DSX POD reference design. The exhibit integrates IT racks, cooling and power distribution systems within a 40-foot container, demonstrating TECO’s one-stop integration and delivery capabilities spanning critical equipment and electromechanical engineering. Since forming a strategic alliance with Hon Hai Technology Group (“Foxconn”) (2317) through an equity swap last year, TECO has continued to deepen the collaboration and leverage the benefits of vertical integration to capture infrastructure opportunities driven by growing demand for AI computing. TECO Group Chairman Morris Li said, “AI is reshaping competition across industries worldwide. Data centers have become critical infrastructure supporting the expansion of computing capacity and industrial transformation. TECO’s modular solutions integrate power, cooling, engineering and energy management. Through TECO’s acquisition of Malaysia-based Dynaciate (now renamed TECO NXG Integrated Services Sdn. Bhd.), we are accelerating the Group’s strategy to become an “AI data center solutions provider.” By expanding our capacity to undertake modular data center engineering projects and completing more than 80% of the modularization process in the factory, we can shorten delivery lead times, helping customers accelerate deployment and strengthen their competitiveness.” Combining Equipment Manufacturing and Engineering for Faster Deployment The  concept for an All-in-One MDC based on NVIDIA DSX POD on display houses IT racks, AC/DC control panels, cooling systems, an energy management system (EMS) and fire protection equipment in a 40-foot container, demonstrating the integrated configuration of computing equipment and electromechanical infrastructure. TECO is committed to serving as customers’ partner for modular data center infrastructure and electromechanical integration, combining its core capabilities in power equipment, cooling and thermal management, and module manufacturing to provide integrated solutions for high-density AI computing. NVIDIA DSX POD is a reference design for complete NVIDIA Vera Rubin AI factories built by partners inside modular containers, integrated and validated before delivery. DSX POD moves the integration and installation of computing, networking, cabling, rack-level power and liquid cooling to the manufacturing facility, reducing the extensive planning, construction, specialized labor and logistics of a traditional onsite build.   In addition to the DSX POD-based MDC concept with Foxconn, TECO’s MDC solutions comprise five core modules: IT, cooling, power, generators and EMS. Each configuration can be tailored to customer requirements, site conditions and reliability needs. Through modular design and factory prefabrication, some assembly work that would otherwise be performed on site can be completed in the factory before installation and system integration on site. This helps reduce construction complexity while improving project quality and delivery efficiency. Customers can also deploy and expand capacity in stages based on their computing needs, allowing infrastructure scale to grow flexibly with their business. TECO is currently carrying out a megawatt-scale MDC project in Malaysia, applying this integrated approach in an actual deployment to meet major cloud service providers’ needs for fast deployment and flexible expansion. The project is expected to be completed and showcased by year-end. Integrating Power and Thermal Management for High-Density AI Computing TECO has extensive experience in data center infrastructure, having undertaken projects with a cumulative capacity of 1 GW. As AI computing density continues to rise, reliable power and efficient cooling have become critical to data center design, increasing the need for closer integration between power and cooling systems. Alongside its MDC, TECO is exhibiting an 800VDC high-voltage direct current power architecture and Solid-State Transformer (SST) technology, demonstrating approaches to reducing power transmission and conversion losses. The SST also provides electrical isolation to support the power requirements of high-density server racks. On the cooling side, TECO brings together three key solutions: the CDU Pump + Industrial Flat-Wire Power Module, the Process Cooling Water (PCW) System, and the Integrated Dual Cooling Series Water chiller/Heat Pump. These systems work together to connect the server-side and facility-side cooling circuits. Through high-efficiency drive systems, integrated piping, and coordinated configuration of the chiller and centralized control system, the solution addresses the cooling, space and modular expansion needs of high-density server racks. This demonstrates TECO’s ability to extend from critical equipment supply to integrated power and thermal management solutions for data centers. Applying Electric Drive Expertise to Robotics and Physical AI In addition to its modular data center solutions, TECO is also exhibiting the M1/M2 Quadruped Joint Module, the TJM Humanoid Joint Module, and the UTX Application-Specific Joint Module. These modules are designed for highly dynamic motion, whole-body joint control, and heavy-load applications, respectively. Potential applications include legged mobile robots, humanoid robots, industrial automation and smart logistics. Through these joint modules, TECO is extending its core electric drive expertise into robotics, demonstrating its potential to expand beyond conventional electromechanical equipment into Physical AI.

World’s first live demonstration of real-time sensor data acquisition and pre-processing on silicon, enabling up to L4 autonomous drivingNuremberg, Germany — At Embedded World 2026, ZF Friedrichshafen AG and SiliconAuto have won the Embedded Award SoC / IP / IC Design category for the co-developed ZF I/O interface chip, tightly integrated with SiliconAuto’s new XMotiv™ M3 microcontroller. Building on a non-commercial collaboration supported by Germany’s Federal Ministry of Education, the joint solution marks a breakthrough in automotive compute architecture by enabling the industry’s first live, real-time demonstration of sensor data acquisition and pre‑processing directly on silicon. The award‑winning design showcases a new I/O interface chip from ZF that integrates all essential ADAS sensor‑interface IP, along with on‑chip processing for camera and radar data, together with SiliconAuto’s XMotiv™ M3 serving as the companion controller. This achievement provides a powerful, scalable alternative to traditional monolithic SoCs. By offloading sensor data handling and pre‑processing to the I/O chip, the system frees up central-compute resources for perception and driving tasks while maintaining full OEM flexibility through standardized high‑speed interfaces such as PCIe and Ethernet. The demonstration positions the combined ZF–SiliconAuto architecture as a next‑generation foundation for ADAS and automated driving systems, from entry-level configurations up to SAE Level 4 capabilities. Be among the first to see this award‑winning technology in action. Join us at the SiliconAuto booth in Hall 4, IC&IP Design Area, Stand 4‑665, for a live demonstration of the silicon powering tomorrow’s automated driving systems. About SiliconAuto SiliconAuto is a fabless semiconductor company focused on everything that moves—cars, trucks, two-wheelers, robots and drones. Founded in 2023 as a joint venture between Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and Stellantis N.V., the company is incorporated in the Netherlands with teams in Europe, Taiwan and India. SiliconAuto provides a path into the world’s most advanced semiconductor ecosystem through a growing portfolio of automotive-grade products paired with solutions to simplify integration and help teams accelerate next-generation vehicles and robots to market. About ZF Friedrichshafen AG ZF is a global technology company supplying advanced mobility products and systems for passenger cars, commercial vehicles and industrial technology. Its comprehensive product range is primarily aimed at vehicle manufacturers, mobility providers and start-up companies in the fields of transportation and mobility. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate as well as enhancing safe mobility. Alongside the automotive sector – passenger cars and commercial vehicles – ZF also serves market segments such as construction and agricultural machinery, wind power, marine propulsion, rail drives and test systems.

Taipei, Dec. 23, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn) announced that its key automotive electronics product, the Telematics Control Unit (TCU), has successfully passed DEKRA process certification and obtained both ISO 26262 Functional Safety certification and ISO/SAE 21434 Automotive Cybersecurity certification. This milestone places FIH among a limited number of companies in the TCU domain to concurrently obtain both certifications, significantly reinforcing its strategic role in the global automotive electronics supply chain. Aaron Lee, Managing Director of DEKRA Taiwan (right), presented the ISO 26262 and the ISO/SAE 21434 Certifications to Dr. Wen Kuo, Vice President of FIH.  Dr. Wen Kuo, Vice President of FIH, stated, “By implementing ISO 26262 and ISO/SAE 21434, FIH has established a comprehensive safety lifecycle management framework that enables customers to reduce system integration risks, accelerate validation timelines, and meet increasingly stringent regulatory requirements. Backed by our deep expertise in the ICT industry, as well as our capabilities in independent design, high-quality manufacturing, and system integration, FIH is committed to delivering robust, secure, and reliable solutions and becoming a long-term, trusted partner for global automakers.”   As the automotive industry accelerates toward electrification and Software-Defined Vehicles (SDVs), functional safety and cybersecurity have become essential thresholds for global OEMs when evaluating Tier-1 suppliers. ISO 26262 is the internationally recognized standard for automotive functional safety, ensuring that electronic and electrical systems remain controllable under fault conditions. Meanwhile, ISO/SAE 21434 establishes a comprehensive cybersecurity framework for road vehicles, encompassing threat analysis, risk assessment, governance, and lifecycle management. Together, these two standards form a core foundation for smart and connected vehicles and are indispensable to the transition toward autonomous driving and SDVs.   As the communication hub of smart and connected vehicles, the TCU supports functions including remote diagnostics, connected vehicle services, vehicle data transmission, and over-the-air (OTA) updates. Its functional safety and cybersecurity protection levels directly impact the stability and risk management of the entire vehicle system. Through the successful attainment of both ISO 26262 and ISO/SAE 21434 certifications, FIH has demonstrated that its capabilities in hardware design, software architecture, secure communications, and cybersecurity protection meet the rigorous requirements expected by leading global automakers.   As global automotive electronic architectures and Software-Defined Vehicles (SDVs) continue to evolve rapidly, safety and cybersecurity requirements across automakers’ supply chains have become increasingly stringent. “FIH’s ability to complete both certifications within a single year and to its achievement in the TCU domain reflects its strong R&D execution and well-established management systems. This achievement aligns closely with global automakers’ expectations for safety, quality, and cybersecurity and represents a highly meaningful industry milestone. We are pleased to witness this accomplishment together with FIH,” said Aaron Lee, Managing Director of DEKRA Taiwan. FIH’s Automotive Electronics team poses for a group photo with the expert team from DEKRA.About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers.   For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

Las Vegas, Taipei, Dec. 16, 2026 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will participate in CES 2026 from January 6 to 9. Under the theme "Driving the Future of Smart Mobility," FIH will showcase its core automotive electronics solutions, including the latest High-Performance Computing (HPC) platform, In-Vehicle Infotainment (IVI) systems, Advanced Driver Assistance Systems (ADAS), and Telematics Control Units (TCUs).To demonstrate the centralized computing power and system integration capabilities of the HPC platform, FIH will present an interactive demo vehicle that allows visitors to control various car functions via the IVI interface to experience seamless operation.   FIH Vice President Dr. Wen Kuo stated, "The automotive industry has shifted from being primarily mechanical-driven to software-centric, which requires powerful centralized computing performance, software update capabilities, and cybersecurity resilience. With extensive experience in electronics product R&D, manufacturing, and system integration, FIH is well-positioned to provide automotive electronics solutions that align with industry trends, enabling automakers to accelerate transformation and enhance deployment flexibility."   FIH's HPC platform offers several advantages to support automakers in developing Software-Defined Vehicle (SDV):   l   Powerful Centralized Computing Capabilities: In addition to IVI and ADAS integration, the HPC platform also supports body control functions, e.g. window control, seat, light control, etc. The total product cost will be optimized for car OEMs. l   Electrical/Electronic Architecture (E/EA) Optimization: Streamlines the traditional Electronic Control Unit (ECU)-intensive distributed architecture by leveraging Zone Control Unit (ZCU), improving overall system collaboration. l   Accelerated Deployment of Innovative Features: Supports real-time Over-the-Air (OTA) software updates across all systems, helping automakers quickly deploy new features and reduce maintenance costs.   FIH will also present its TCU product line, including the e-Call certified 4G product supplied to a dozen globally renowned auto brands; the 5G variant that supports seamless cloud integration, real-time diagnostics, and high-speed data transmission; and modem-only models customizable for various requirements. In addition, FIH offers a multi-modem, multi-network TCU that enables carmakers to achieve level 4 autonomous driving and remote vehicle operation.   FIH's world-class TCU solutions have obtained ISO 26262 functional safety and ISO/SAE 21434 cybersecurity engineering certifications, as well as compliance with international standards such as ASPICE CL2, UN ECE R155 for cybersecurity, and R156 for software updates, demonstrating FIH’s comprehensive cybersecurity readiness and ensuring safe and reliable large-scale deployment.   In addition to its automotive electronics solutions, FIH will also showcase its self-designed Ku and Ka-band LEO user terminals, which integrate flat-panel phased array antenna system that can be applied to diverse scenarios such as maritime, land mobility, and aviation, supporting customers in deploying next-generation 6G communications.   Leveraging over two decades of experience in wireless communications and ICT, as well as extensive development and integration capabilities in mobile phones and IoT products, FIH continues to deepen its three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics. Through its global footprint and flexible production strategies, FIH aims to create exceptional value for customers worldwide.   Welcome to visit us at Booth No. 4167, West Hall, Las Vegas Convention Center.     CES 2026 FIH Exhibition Information: l   Dates: January 6 to January 9, 2026 (Tuesday to Friday) l   Location: Las Vegas Convention Center, the U.S. l   Booth Number: No.4167 About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers.   For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

CEO Prince Fahad N. Al Saud: EV Charging Is Core Energy Infrastructure in the AI Era[Dammam, Saudi Arabia — December 8, 2025] FIT Hon Teng (6088.HK), a subsidiary of Hon Hai Technology Group (Foxconn) (TWSE:2317), today announced that Smart Mobility — its joint venture with Saudi-based Saleh Suleiman Alrajhi & Sons — has officially broken ground on a new manufacturing facility at King Salman Energy Park (SPARK) in Dammam. The ceremony marks a new chapter in Saudi Arabia’s journey toward localized production of EV charging infrastructure. The ceremony opened with remarks by Mishal I. Al-Zughaibi, President and CEO of SPARK. He noted that SPARK is steadily developing into a leading hub for advanced energy and industrial technologies in the Middle East. Located close to Saudi Arabia’s core energy infrastructure, SPARK offers a mature logistics ecosystem and proximity to Arabian Gulf ports. In the future, it will also connect to the GCC railway network, positioning it as a strategically important base for regional manufacturing, exports, and energy technology innovation. Smart Mobility has also installed its high-quality chargers serving as the park’s first EV charging station. This not only demonstrates its technological capabilities, but also underscores Smart Mobility’s role as a key enabler in the transformation of the energy park. In his remarks, Smart Mobility CEO Prince Fahad N. Al Saud noted that while low fuel prices are often cited as a challenge to EV adoption in Saudi Arabia, the Kingdom’s ambition to become the future energy hub for AI is a clear national vision. Globally, the automotive sector is rapidly transitioning toward AI-driven smart mobility. Whether in Level 4 autonomous driving, vehicle connectivity, or AI-based predictive systems, these capabilities all rely fundamentally on electrification. Prince Fahad emphasized that EVs are not merely a for traditional fuel cars, but the essential computing platform for automotive advancement in the AI era. If Saudi Arabia aims to lead in AI, smart cities, and automation, EV charging networks must be regarded as part of the national energy infrastructure. SPARK, rooted in the energy sector, is the ideal base to support this transition. SPARK is wholly owned by Saudi Aramco, one of the world’s top-ten companies by market capitalization and recognized for its rigorous governance, transparency, and engineering excellence. SPARK’s governance standards, engineering protocols, and compliance frameworks are highly aligned with FIT’s global manufacturing systems, providing a solid foundation for precision manufacturing and future capacity expansion. In addition, SPARK’s geographic advantages enhance the competitiveness of Saudi-made products across the region, enabling EV charging equipment manufactured in the Kingdom to access GCC markets more efficiently through the GCC customs union, cross-border logistics, and the future GCC railway network. FIT Chairman Sidney Lu stated in his remarks that the establishment of the Saudi factory represents not justa manufacturing site for FIT, but a long-term commitment to the Kingdom’s industrial development. The creation of Smart Mobility and today’s groundbreaking ceremony are built on mutual trust and collaboration with joint-venture partner Saleh Suleiman Alrajhi & Sons. They also reflect CEO Prince Fahad’s clear strategic vision and steadfast leadership, which have been crucial in bringing the project to fruition. He added that support from the Ministry of Energy and other relevant authorities throughout the SPARK site-selection process significantly was significantly helpful to the project. Chairman Lu highlighted that FIT operates factories and R&D centers across Asia, Europe, and the Americas, and also automotive production lines in Africa serving European markets — experience that equips the company to build highly reliable, cross-regional manufacturing networks. For the new Saudi facility, it represents FIT establishing an important footprint in EMEA: Saudi Arabia is not merely seeking overseas manufacturing capacity, but is inviting global technology partners to help shape the next chapter of its energy and industrial future. For FIT, this factory represents not only an asset but a commitment — a long-term partnership, shared vision, and mutual commitment to progress. The groundbreaking ceremony also aligns with the “Saudi Made” program promoted by the Local Content and Government Procurement Authority, which requires government procurement to prioritize locally manufactured products. The Smart Mobility plant will produce multiple EV charging hardware models, supported by a Charging Point Management System (CPMS) that has undergone more than six months of field testing in Saudi Arabia. Together, these developments will strengthen the Kingdom’s local supply chain and support deployments across public and commercial sectors. The ceremony also welcomed two key Public Investment Fund (PIF)–backed organizations: EVIQ (EV Infrastructure Company) and NAVA (National Automotive and Vehicles Academy), demonstrating strong governmental commitment and cross-agency support for accelerating EV infrastructure. Smart Mobility announced that three EV charging products have received SASO certification, and its CPMS is expected to begin commercial operation in the first half of 2026. The 9,490-square-meter facility is scheduled for completion in the third quarter of 2026 and, following SPARK’s required verification processes, will begin the production in the fourth quarter.

（Shared from the Institute for Biotechnology and Medicine Industry）With nursing shortages reaching critical levels globally, Foxconn's Nurabot deployment marks a pivotal moment where manufacturing expertise meets healthcare innovation, promising to restore the human touch in medical care by liberating staff from routine logistics. In a significant move that underscores its strategic pivot into next-generation industries, Taiwan’s manufacturing giant Foxconn is poised to deploy its healthcare robot, Nurabot, in hospitals across Taiwan starting this October. This launch is a foundational component of Foxconn’s ambitious Smart Hospital initiative, a long-term vision designed to harness the power of AI, robotics, and digital integration to fundamentally transform the healthcare ecosystem. The Nurabot is the result of a powerful collaboration between Foxconn, renowned Japanese robotics firm Kawasaki, and the Taichung Veterans’ General Hospital (TCVGH). This partnership is more than a technical venture; it represents a commitment to creating a future where technology serves as a seamless extension of human care. According to Barry Chiang, Foxconn’s Chief of Digital Health and President of its B Business Group and a key leader in this transformation, the Nurabot is a pivotal step toward a new era. “The robot will be in service after completing the ongoing stress test at TCVGH, and with deployment completed by year end, we expect to launch the total solution in 2026, just in time for the government’s Healthy Taiwan Cultivation Plan,” Chiang stated during an exclusive interview with the Institute for Biotechnology and Medical Industry (IBMI). A Solution Born from User-Centric Design Foxconn’s foray into healthcare is not a simple transfer of its industrial robotics expertise. While the company is a global leader in producing robotic arms for “lighthouse factories” and complex manufacturing lines, it recognized from the outset that medical environments are vastly different. Robots in a hospital must meet stringent safety, regulatory, and user experience requirements that are far more complex than those on a factory floor. This understanding led to a unique, user-centric “design-thinking” approach. The journey began in 2022 when Chiang established a new organization, which later became the Taiwan Digital Health Alliance (HiMEDt). Rather than starting with a product, his team began by deeply embedding themselves in the very environments they hoped to improve. They conducted in-depth visits to key hospitals across Taiwan, communicating directly with doctors and nurses to map a comprehensive understanding of their daily challenges.First-hand observations at the Taichung Veterans’ General Hospital were particularly illuminating. The research team discovered a striking inefficiency: nursing staff spent an estimated 30-40% of their valuable time on logistical tasks—delivering specimens, blood bags, and medicines. The rest of their day was equally demanding, consumed by critical, patient-facing duties such as providing health education, conducting routine rounds to check patient conditions, and listening for subtle sounds to prevent accidents like falls. This insight proved that offloading routine, repetitive tasks would not simply increase efficiency; it would free up nurses to focus on the human elements of care that technology cannot replicate. To translate these insights into a viable product, Foxconn assembled a truly multidisciplinary team. It included not only AI algorithm engineers and industrial designers but also user interface designers and project managers with specialized biotech backgrounds. This diverse expertise ensured that the robot was not only technologically sound but also intuitive for medical staff and compliant with all necessary regulations. The Technology Powering Nurabot At its core, the Nurabot is a sophisticated autonomous mobile robot (AMR) engineered to address the specific pain points identified in the user research. Its primary function is to reduce the workload of nursing staff by autonomously delivering blood and urine specimens and carrying temperature-sensitive blood bags in a dedicated, low-temperature storage trunk. To guarantee security and accuracy, the robot is equipped with biometric mechanisms, ensuring that critical medical supplies are delivered to the correct person at the right location, every time. One of Nurabot’s most impressive features is its seamlessly integrated four-cloud architecture, built on NVIDIA’s three computing platforms—Omniverse, Isaac Sim, and Jetson—and directly connected to the hospital HIS system to enable automated task dispatching. While this may appear straightforward, it is powered by a complex, multi-layered computing framework that Barry Chiang poetically described as a “chorus.”  To achieve this perfect harmony, Nurabot leverages four distinct "clouds" working in unison: FoxBrain: Foxconn’s proprietary large language model, which serves as the robot’s central cognitive engine. Digital Twin Environment (Omniverse): A collaborative simulation and testing environment built on NVIDIA Omniverse, enabling continuous validation and optimization of Nurabot’s performance through digital twin modeling. NVIDIA Jetson AGX Orin: This powerful AI-at-the-edge computing platform allows Nurabot to process sensory data in real time, enabling it to navigate complex hospital environments, avoid obstacles, and make immediate, safe decisions. The Hospital's Private Cloud (HIS): This system integrates the robot directly into the hospital's internal network, allowing it to receive orders and securely access necessary information. In a hospital environment that operates 24/7, reliability is paramount. Nurabots are designed for continuous service, powered by swappable batteries that can be exchanged instantly at a charging station. This simple but critical feature ensures that a Nurabot is always ready for its next mission, minimizing downtime and maintaining the flow of operations. Aligning with Taiwan's National Vision Foxconn is strategically launching the Nurabot service in collaboration with key medical institutions, including Taichung Veterans’ General Hospital and the Matzu Hospital in Baishatun. This initial rollout has already generated significant interest, with major hospitals like Shin Kong Hospital and Kaohsiung Medical School Hospital expressing a desire to collaborate. The timing of this initiative could not be more perfect, as it aligns directly with Taiwan’s Healthy Taiwan Cultivation Plan. This five-year, NT$48.9 billion (US$1.61 billion) government initiative is aimed at accelerating the digital transformation of the country’s medical landscape. While many hospitals are eager to participate and secure a portion of the funding, very few qualified providers are capable of delivering a comprehensive, full-scale solution like the one being offered by Foxconn. The Nurabot is just one piece of this larger vision. Foxconn has also collaborated with hospitals like New Taipei Municipal TuCheng Hospital and Taipei Veterans’ General Hospital to build cancer and disease datasets for AI models called CoDoctor AI. This work is a testament to the company’s broader 3+3+3 strategy, which identifies digital health and robotics as two of its three future megatrends, with AI as one of its core technologies. By leveraging its vast computing power and infrastructure, Foxconn is positioning itself as the ideal partner for hospitals seeking to qualify for government funding and lead the charge in the digital transformation of healthcare. The deployment of Nurabot is a tangible manifestation of Foxconn's strategic evolution. It’s not just about building a product; it’s about pioneering a new model for healthcare that could address critical global challenges like nursing shortages and burnout. As Nurabot begins its service in Taiwan, it will serve as a powerful proof of concept for a future where technology empowers, rather than replaces, human caregivers.  

Point2’s Pioneering e-Tube RF Interconnect Platform Breaks Barriers of Copper and Optical Cabling to Accelerate AI Cluster Scale-Up in Hyperscale Data CentersSAN JOSE, Calif., Oct. 14, 2025 – Point2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for scalable interconnects in AI data centers, will showcase its latest advancements in e-Tube™ RF rack-scale data transmission over plastic waveguides at the upcoming Open Compute Project (OCP) Global Summit, held October 13–16 at the San Jose Convention Center. As an active contributor to OCP’s mission of open innovation, Point2 will present its vision for next-generation AI infrastructure through technical sessions and live demonstrations.   Point2’s patented e-Tube RF platform delivers a compelling alternative to copper and optics, offering 10x cable reach of copper at a similar cost structure, while 3x lower cost and power and 1000x lower in latency than traditional optical interconnect, creating a new category in AI interconnect. At the heart of Point2’s showcase is its rapidly expanding e-Tube cable and connectorization ecosystem, developed in collaboration with Molex and Foxconn Interconnect Technology (FIT). This ecosystem enables seamless integration of e-Tube into standard data center architectures, accelerating deployment and scalability for hyperscale and enterprise AI clusters.   Key Use Cases to Be Highlighted at OCP: OSFP Pluggable Active RF Cable (ARC): Point2 will present the e-Tube ARC cable for intra-rack and cross-rack interconnects, offering plug-and-play compatibility of the MSA OSFP form factor. Rack-Scale Compute Fabric Interconnect: Point2 will also showcase e-Tube as the transformative RF alternative to copper in backplanes with a simple yet elegant approach to connecting GPU accelerators through the compute fabric for AI cluster scale-up.   “AI workloads are pushing the limits of conventional interconnect technologies,” said Dr. Sean Park, Co-Founder and CEO of Point2 Technology. “With e-Tube, we’re leaping past the copper cliff and avoiding the optical penalties to deliver a scalable, low-latency, energy-efficient interconnect platform. Our collaboration with Molex and FIT ensures that e-Tube will be ready for demanding rack-scale deployments.”   “FIT is excited to partner with Point2 to bring e-Tube technology into mainstream rack-level deployments,” said Julia Jiang, VP of Marketing and Sales at FIT, “Our joint efforts will help data center operators achieve higher performance and lower power consumption while simplifying interconnect architecture which can deliver copper like reliability and economics to our customers.”   “Molex is proud to lead the innovation of high-performance connector and cable solutions that enable Point2’s e-Tube solutions to meet the demands of next-generation data centers,” said Chad Jameson, General Manager, I/O Solutions at Molex. “Together, we’re enabling highly reliable, scalable, and manufacturable AI interconnects for next-generation AI data centers.”   Point2 Technology will participate in the OCP Global Summit with a speaking session by Dr. Sean Park, and a presence in the Innovation Village, and at a private suite at the Hilton San Jose where the company will showcase its latest technologies. Additional details as follows:   Speaking Session: “Leap Over the Copper Cliff and Avoid the Optical Penalties to Scale Up AI Clusters” Dr. Sean Park, Co-Founder & CEO of Point2 Technology, will address the physical and economic boundaries of copper and optical interconnects—and how e-Tube technology overcomes these limitations to enable scalable, energy-efficient AI cluster scale up.   Date: Wednesday, October 15 Time: 1:55 – 2:15 PM PST Location: SJCC – Concourse Level – 210ABEF   Live Demonstrations in the Innovation Village Point2 will also demonstrate its ground-breaking e-Tube technology in the FTS Emerging Technology section of the Innovation Village on the OCP Exhibition floor. Attendees can witness live demos of e-Tube interconnects and engage directly with Point2’s leadership team.   Live Demonstrations at the Hilton San Jose Private Suite Point2 will also host private meetings with demonstrations of its e-Tube ARC, AEC, and roadmap discussion. Contact sales.us@point2tech.com to schedule a meeting.   About Point2 Technology Point2 Technology, headquartered in San Jose, Calif., designs and manufactures ultra-low power, low-latency, point-to-point interconnect and range enhancement SoC solutions purpose-built to meet the bandwidth requirements of hyperscale AI/ML datacenters and edge cloud infrastructure. Founded by an accomplished team from Marvell, Finisar, and Samsung, Point2 is a leading innovator that is reimagining data center and 5G cloud infrastructure interconnect in the multi-terabit era. www.point2tech.com.   About Foxconn Interconnect Technology Limited (FIT Hon Teng Limited) Foxconn Interconnect Technology Limited (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Asia. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, Mobility, and Audio, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com   About Molex Molex is a global electronics leader committed to making the world a better, more-connected place. With a presence in more than 38 countries, Molex enables transformative technology innovation in the consumer device, aerospace and defense, data center, cloud, telecommunications, transportation, industrial automation and healthcare industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for Life. For more information, visit www.molex.com.

Taipei, September 17, 2025 – Foxconn Interconnect Technology (FIT Hon Teng, 6088.HK), a subsidiary of Hon Hai Technology Group, today hosted its inaugural FIT Tech Day 2025 in Taipei. In the opening remarks, FIT Chairman Sidney Lu emphasized that “data and power” will be the twin foundations of AI mobility. “Everyone has heard the phrase ‘Data is the New Oil,’ but in the age of AI, oil fields alone are not enough. You must also have pipelines and energy conversion to drive the future,” said Lu. “This is precisely where FIT plays a role. Connectors and high-speed cables act as the nerves, transmitting signals and data, while power systems serve as the lifeblood, providing the sustained and efficient energy required for massive AI computing power.” Lu highlighted that AI is redefining the future landscape of mobility, and the establishment of One Mobility builds on FIT’s acquisition of German brands Autokabel and Voltaira, with a strong focus on high-efficiency power systems and integration expertise. Together with global partners, FIT aims to drive the next generation of mobility ecosystems, opening new market opportunities and cross-industry collaborations. The event also welcomed HH Prince Fahad bin Nawaf Al Saud of Saudi Arabia, who addressed the audience in his role as CEO of FIT’s Saudi joint venture Smart Mobility. Echoing the vision of “Data is the New Oil,” Prince Fahad noted that since HRH Crown Prince Mohammed bin Salman launched Vision 2030 in 2016, Saudi Arabia has made significant reforms and progress, with AI hardware and software development becoming fundamental pillars of national advancement. Since the joint venture agreement was signed last October, Smart Mobility was officially launched in May this year. Within just a few months, it has already completed three SASO product certifications and is preparing for the groundbreaking of a new factory at the end of the year, marking FIT’s first manufacturing base in the Middle East. Prince Fahad’s presence at the event not only underscores his strong support for FIT, but also reflects the firm commitment of both parties to advance technology development and co-create the future. About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Asia. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, Mobility, and Audio, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com

Munich, Taipei, Sep. 2, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will unveil its latest automotive electronics solutions at IAA Mobility 2025, Europe’s largest automotive trade fair, from September 9 to 12. Embodying its commitment to “Driving the Future of Smart Mobility,” FIH will feature its advanced High-Performance Computing (HPC) platform, Advanced Driver Assistance Systems (ADAS), and Telematics Control Units (TCU). These solutions exemplify the company’s core strengths in technological innovation and seamless integration.“The global automotive industry is rapidly electrifying, demanding a shift from mechanical-driven to electronics- and electrically driven design," FIH Vice President Dr. Wen Kuo commented. "With over two decades of experience in wireless communication and IoT product design, manufacturing, and integration, FIH helps traditional automakers accelerate this transition. Our automotive electronics solutions and comprehensive one-stop services enable faster product adoption and seamless system integration—empowering clients to lead in the era of smart mobility.”   FIH is showcasing its evolved HPC flagship product at IAA Mobility 2025, responding to the increasing demands on frequent software feature updates and the need for functionality enhancement by rapid iterations in the automotive sector. The product integrates In-Vehicle Infotainment (IVI) and Advanced Driver Assistance Systems (ADAS), together with the advanced design of the Zone Control Unit (ZCU) and Electrical/Electronic Architecture (E/EA) to enable software upgrades for all vehicle components — overcoming the current limitation where updates are usually confined to just a few key parts. Through such an innovative design, the computing power and memory are centralized and hence able to support real-time over-the-air (OTA) software updates to all vehicle components, delivering the true next-generation Software-Defined Vehicle (SDV) solution.   FIH will also present two TCU solutions: an e-Call certified 4G version currently supplied to a globally renowned automotive manufacturer, and a 5G version designed for seamless cloud integration, enabling real-time data exchange and remote diagnostics. Both TCUs have achieved key industry certifications, including IATF 16949 and ASPICE, as well as safety and cybersecurity standards such as ISO 26262, UN ECE R155 for cybersecurity, and UN ECE R156 for OTA software updates.   Building on its global footprint and agile production, FIH continues to strengthen its core automotive electronics business alongside smart manufacturing and manufacturing equipment/robotics, delivering exceptional value to customers worldwide.   Visit FIH at Booth A13, Hall B3, at the Trade Fair Center Messe München.FIH’s self-developed HPC platform, ADAS, and TCU will be exhibited at IAA Mobility 2025.IAA Mobility 2025 FIH Exhibition Information: l   Dates: September 9 to September 12, 2025 (Tuesday to Friday) l   Location: Trade Fair Center Messe München, Germany l   Booth Number: Hall B3.A13  

Taipei, Aug. 18, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), has long adopted anti-bribery and anti-corruption practices. To further meet international standards, FIH collaborated with Ernst & Young (China) Advisory Limited Forensic & Integrity Services team in 2024 to implement the ISO 37001 Anti-Bribery Management Systems and officially obtained the Certificate of Registration in 2025, becoming the first subsidiary within Hon Hai Technology Group to receive this recognition.FIH held the ISO 37001 Anti-Bribery Management System certification ceremony. From left to right: FIH Internal Audit Director Johnny Kan, Ernst & Young (China) Advisory Limited China South Forensic & Integrity Services Partner Derrick Li, FIH CFO Danny Tam, BSI Greater China Standard Solutions Director David Zhu, FIH Director Yu Chia Huang, Ernst & Young (China) Advisory Limited China South Forensics & Integrity Services Executive Director Carol Li, BSI Sales Director for the Yangtze River Delta Region Kent Lian, and BSI Senior Manager of Solutions Andson Yang.FIH CFO Danny Tam stated, "Integrity is a core value at FIH. We are dedicated to upholding the highest standards of transparency, establishing strong governance, and fostering a culture of ethics and dignity. With a zero-tolerance policy toward bribery and corruption, we have implemented a comprehensive anti-bribery management system aligned with our business goals. ISO 37001 certificate reflects FIH’s firm respond to global ESG trends and continuous enhancement of corporate governance."BSI Greater China Standard Solutions Director David Zhu added, "Integrity is a key indicator of a company’s competitiveness. FIH’s proactive implementation of ISO 37001 demonstrates how a systematic management framework can effectively prevent, detect, and address bribery risks. This not only showcases FIH’s culture of integrity and governance capabilities, but also creates a competitive advantage and lays a solid foundation for sustainable development."FIH has established comprehensive anti-corruption policies that correspond to its evolving business goals. FIH’s Internal Audit Department introduced regular bribery risk assessment and developed the Anti-Corruption Manual in both Chinese and English to strengthen preventive measures. All employees are required to complete annual anti-corruption training. In addition, FIH’s Code of Conduct clearly outlined strictly prohibited behaviors and enforced a zero-tolerance approach to acts of corruption, bribery, embezzlement, or other misconduct for all directors, management, and employees.To ensure ethical practices throughout its supply chain, FIH also regularly assess supplier business ethics risks, perform due diligence, and conduct internal control audits focusing on anti-corruption and bribery. If any zero-tolerance violations are identified during audits, the supplier is disqualified from new projects. Additionally, FIH has established whistle-blowing policies that allows individuals to report fraudulent, unethical or improper conduct via designated hotlines or other means. All reports are handled with strict confidentiality to protect whistleblowers from retaliation, victimization, discrimination, or any other adverse consequences.Anti-bribery is a cornerstone of sustainable development. FIH will continue to enhance staff training and management while working closely with suppliers to build trustworthy, ethical business relationships. Through high standards of business ethics, FIH aims to build a reliable ecosystem and move steadily toward a sustainable future.The attainment of ISO 37001 certificate reflects FIH’s firm respond to global ESG trends and continuous enhancement of corporate governance.About FIH Mobile LimitedFIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers. For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.