TECO Electric & Machinery Co. (1504) returns to Hon Hai Tech Day today (October 30) for the second year, highlighting their collaboration with Foxconn  on a Modular Data Center (MDC) concept based on the NVIDIA DSX POD reference design. The exhibit integrates IT racks, cooling and power distribution systems within a 40-foot container, demonstrating TECO’s one-stop integration and delivery capabilities spanning critical equipment and electromechanical engineering. Since forming a strategic alliance with Hon Hai Technology Group (“Foxconn”) (2317) through an equity swap last year, TECO has continued to deepen the collaboration and leverage the benefits of vertical integration to capture infrastructure opportunities driven by growing demand for AI computing. TECO Group Chairman Morris Li said, “AI is reshaping competition across industries worldwide. Data centers have become critical infrastructure supporting the expansion of computing capacity and industrial transformation. TECO’s modular solutions integrate power, cooling, engineering and energy management. Through TECO’s acquisition of Malaysia-based Dynaciate (now renamed TECO NXG Integrated Services Sdn. Bhd.), we are accelerating the Group’s strategy to become an “AI data center solutions provider.” By expanding our capacity to undertake modular data center engineering projects and completing more than 80% of the modularization process in the factory, we can shorten delivery lead times, helping customers accelerate deployment and strengthen their competitiveness.”

Combining Equipment Manufacturing and Engineering for Faster Deployment

The  concept for an All-in-One MDC based on NVIDIA DSX POD on display houses IT racks, AC/DC control panels, cooling systems, an energy management system (EMS) and fire protection equipment in a 40-foot container, demonstrating the integrated configuration of computing equipment and electromechanical infrastructure. TECO is committed to serving as customers’ partner for modular data center infrastructure and electromechanical integration, combining its core capabilities in power equipment, cooling and thermal management, and module manufacturing to provide integrated solutions for high-density AI computing.

NVIDIA DSX POD is a reference design for complete NVIDIA Vera Rubin AI factories built by partners inside modular containers, integrated and validated before delivery. DSX POD moves the integration and installation of computing, networking, cabling, rack-level power and liquid cooling to the manufacturing facility, reducing the extensive planning, construction, specialized labor and logistics of a traditional onsite build.

In addition to the DSX POD-based MDC concept with Foxconn, TECO’s MDC solutions comprise five core modules: IT, cooling, power, generators and EMS. Each configuration can be tailored to customer requirements, site conditions and reliability needs. Through modular design and factory prefabrication, some assembly work that would otherwise be performed on site can be completed in the factory before installation and system integration on site. This helps reduce construction complexity while improving project quality and delivery efficiency. Customers can also deploy and expand capacity in stages based on their computing needs, allowing infrastructure scale to grow flexibly with their business. TECO is currently carrying out a megawatt-scale MDC project in Malaysia, applying this integrated approach in an actual deployment to meet major cloud service providers’ needs for fast deployment and flexible expansion. The project is expected to be completed and showcased by year-end.

Integrating Power and Thermal Management for High-Density AI Computing

TECO has extensive experience in data center infrastructure, having undertaken projects with a cumulative capacity of 1 GW. As AI computing density continues to rise, reliable power and efficient cooling have become critical to data center design, increasing the need for closer integration between power and cooling systems. Alongside its MDC, TECO is exhibiting an 800VDC high-voltage direct current power architecture and Solid-State Transformer (SST) technology, demonstrating approaches to reducing power transmission and conversion losses. The SST also provides electrical isolation to support the power requirements of high-density server racks.

On the cooling side, TECO brings together three key solutions: the CDU Pump + Industrial Flat-Wire Power Module, the Process Cooling Water (PCW) System, and the Integrated Dual Cooling Series Water chiller/Heat Pump. These systems work together to connect the server-side and facility-side cooling circuits. Through high-efficiency drive systems, integrated piping, and coordinated configuration of the chiller and centralized control system, the solution addresses the cooling, space and modular expansion needs of high-density server racks. This demonstrates TECO’s ability to extend from critical equipment supply to integrated power and thermal management solutions for data centers.

Applying Electric Drive Expertise to Robotics and Physical AI

In addition to its modular data center solutions, TECO is also exhibiting the M1/M2 Quadruped Joint Module, the TJM Humanoid Joint Module, and the UTX Application-Specific Joint Module. These modules are designed for highly dynamic motion, whole-body joint control, and heavy-load applications, respectively. Potential applications include legged mobile robots, humanoid robots, industrial automation and smart logistics. Through these joint modules, TECO is extending its core electric drive expertise into robotics, demonstrating its potential to expand beyond conventional electromechanical equipment into Physical AI.