18 June 2026, Taipei, Taiwan – Hon Hai Research Institute (HHRI) today announced a major breakthrough in its Post-Quantum Cryptography (PQC) research and development. SNOVA, a digital signature algorithm co-developed with deep involvement from HHRI experts, has officially been selected for the third round of the onramp competition of the U.S. National Institute of Standards and Technology (NIST) PQC Standardization Project. Following the technical prowess previously demonstrated by Preon—another candidate algorithm involving HHRI participation—SNOVA's advancement further validates the global cryptographic community's recognition of the Institute's core technological strengths. It signifies that the HHRI team has fully mastered critical, next-generation capabilities in cybersecurity defense. Professor Lih-Chung Wang, a key contributor to the SNOVA algorithm, is currently seconded to HHRI as a Distinguished Researcher. During the secondment period, Professor Wang collaborated closely with the Information Security Research Center's cybersecurity team to investigate hardware acceleration strategies and optimization methods for the mathematical structure underlying SNOVA. In addition to delivering the core advantages of "short signatures" and "low computational overhead" inherent to its algorithm family, SNOVA achieves a critical breakthrough in its "small public key" characteristic. This breakthrough substantially improves the algorithm's universal versatility across diverse application scenarios and boosts hardware computing efficiency. This crucial edge was strategically targeted by the team from an early stage and stands as a pivotal factor in winning NIST's favor and securing its advancement to the third round. Simultaneously holding two pioneering candidate technologies, SNOVA and Preon, reflects HHRI's strategic, multi-path deployment across several post-quantum technological trajectories, encompassing Lattice-based, Multivariate (MQ), and Zero-Knowledge Proof (ZKP) cryptographic frameworks. This multi-path approach aligns perfectly with NIST's overarching strategy of ensuring algorithmic diversity, while granting Hon Hai Technology Group (Foxconn), the parent of HHRI, the research caliber to participate in international standard-setting across diverse technological dimensions. Faced with a future full of uncertainties, this parallel multi-track strategy effectively serves as a multi-layered insurance policy for Foxconn. The NIST PQC Standardization Project is universally acknowledged as the world's most authoritative and influential screening mechanism for post-quantum cryptography. Algorithms submitted by countless top-tier scientists and institutions globally undergo rigorous, multi-round elimination. Advancing to the third round indicates that SNOVA has successfully withstood the most stringent cryptanalysis from the world's leading cryptographers. This achievement proves that HHRI's capabilities in "Quantum Security" are truly world-class, demonstrating its global-tier scientific research strength in cutting-edge, core software cryptography and forward-looking cybersecurity R&D. Looking ahead, Foxconn through HHRI will continue to invest resources in strengthening the security analysis and implementation of SNOVA, fostering its further development and adoption. This milestone is not only a successful paradigm of industry-academia collaboration in Taiwan, but also marks the Group's commitment to transforming into a "Cybersecurity Technology Pioneer," dedicated to providing clients with the most robust and reliable foundational technological protection as the world transitions into the quantum computing era.

17 June 2026, Taipei, Taiwan and Paris, France – Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest artificial intelligence server provider, accelerated its global leadership in AI factories and sovereign AI infrastructure by showcasing at VivaTech its end-to-end integration capabilities that also stand up the world’s most state-of-the-art, rack-scale AI supercomputer. Considered Foxconn’s European debut and a nod to Europe's biggest startup and tech event, the world’s largest electronics manufacturer brought the cutting-edge technology – to the continent for the first time – including NVIDIA Vera Rubin NVL72, NVIDIA HGX platforms and NVIDIA MGX architectures, as well as two of its electric vehicles and advances in humanoid robotics. “Foxconn is connecting with transformation opportunities and diversified business models across European industries. By fostering technology collaboration with industry, start-ups, government and academia, we strengthen our Build-Operate-Localize presence in Europe,” said Foxconn Vice President and Spokesperson James Wu, referring to the Group’s innovative BOL business model that supports local communities. Underscoring the market’s importance, Foxconn, with partners Bull of France, a leader in advanced computing and AI, and NVIDIA also announced a strategic milestone to build the NVIDIA Vera Rubin NVL72 platform from Europe that will commercialize under the Bull brand. At Foxconn Booth 2B41, the NVIDIA Vera Rubin NVL72 represents the next frontier of Agentic AI. On display, as well, were NVIDIA HGX Rubin NVL8 and NVIDIA MGX 4U system, affirming the Group’s manufacturing strengths in high-density AI racks, compute trays, liquid cooling, power delivery, and system integration. Moreover, with its dedicated business unit for AI supercomputing & cloud operations, Visionbay.ai – which is an NVIDIA Cloud Partner (NCP) – the Group showed end-to-end solutions that cover the full stack AI factory operations to technical services and application ecosystems. For the first time in Europe, the public can see and sit in two modern EVs offered by Foxconn unit FOXTRON Vehicle Technologies under a Contract Design and Manufacturing Service, or CDMS, business model. A MODEL B sporty crossover – being sold in Taiwan under the BRIA brand – and a MODEL D lifestyle multipurpose utility vehicle represent the Group’s capabilities in EV platforms, complete vehicle design, smart cockpits and advanced electronic/electrical (E/E) architectures. Meanwhile, a wheeled humanoid demonstrates dual-arm collaboration for precision assembly tasks. The embodied intelligence is derived from actual factory scenarios, combining simulation-based training with on-site iteration to enable rapid deployment and scalable rollout across manufacturing facilities.   About VivaTech here. About Foxconn here.

Paris, France – 17 June, 2026 – As part of their recently unveiled collaboration,Bull, a leader in advanced computing and AI, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technology solutions provider, today announce a first strategic milestone with the production in Europe of key components for commercialisation under the Bull brand. This announcement builds directly on the partnership unveiled on 1 June 2026, which combines Bull’s expertise in AI systems design and deployment with Foxconn’s industrial scale and supply chain capabilities, to manufacture AI infrastructure for AI Factories and AI Cloud providers, from Europe. With the NVIDIA Vera Rubin NVL72 platform, the partnership moves into execution, bringing its industrial ambition to life through the production of advanced AI systems in Europe, and opening the path to supporting a broader set of technology architectures over time. Systems will be manufactured and initially tested at Foxconn’s facilities in the Czech Republic, before being assembled, integrated and fully validated at Bull’s factory in Angers, France. Designed for the most demanding AI workloads in the age of Agentic AI, these AI servers and data centres will address the needs of neo-cloud providers, cloud service providers and the emerging generation of AI factories across Europe and beyond. Beyond hardware, the ability to manage and operate AI infrastructure end-to-end is becoming critical. In this context, Bull is providing the AI software layer with embedded AI use cases and data science expertise to give customers greater control over how systems are deployed, secured and optimised - extending the “made in Europe” model from manufacturing to operations. Together, these developments reinforce the ambition behind the Bull–Foxconn partnership: anchoring a more resilient and efficient AI supply chain in Europe, with a competitive time to market, while enabling the emergence of scalable, high-performance infrastructure for the region’s most demanding AI workloads. Emmanuel Le Roux, CEO of Bull: “The partnership between Bull and Foxconn marked a turning point in the development of European manufacturing capacity for AI infrastructure, bringing together system design, industrialisation and supply chain execution across France and the Czech Republic. Made in Europe to serve Bull’s global AI ambitions, this initiative now takes a further step forward with the introduction of NVIDIA Vera Rubin NVL72, translating that vision into concrete solutions for the next generation of AI deployments.” James Wu, Foxconn Vice President: “Foxconn is proud to partner with Bull and NVIDIA to help build the foundation for AI factories, sovereign AI and next-generation data center infrastructure in Europe. By combining Bull’s leadership in European supercomputing, NVIDIA’s accelerated computing platform, and Foxconn’s global manufacturing and deployment capabilities, we are creating an ecosystem that can accelerate Europe’s AI ambitions and strengthen its long-term technological competitiveness.” Serge Palaric, Vice President Alliances, Global CSP & ISV EMEA, NVIDIA: “The collaboration between Bull and Foxconn, built on NVIDIA Vera Rubin NVL72, is exactly the kind of deep industrial commitment that will underpin the next chapter of AI in Europe. By anchoring high-performance AI manufacturing in France and the Czech Republic, this partnership gives European enterprises, AI factories and cloud providers access to the world's most advanced compute — on their terms, at scale, and from within Europe. NVIDIA is proud to support that ambition." Arnaud Bertrand, CTO of Outscale: “This is a decisive step forward for Europe’s digital and industrial sovereignty. With Bull and Foxconn bringing NVIDIA Vera Rubin NVL72 to life in Europe - and critical capabilities anchored in France - it sets a new benchmark for a resilient, end‑to‑end European AI supply chain, ready to support the next generation of cloud and AI services.” Damien Lucas, CEO of Scaleway: "At Scaleway, we have two obsessions: ensuring immunity from non-European extraterritorial laws and limiting technological dependencies. Thanks to this partnership, Bull is bringing a more European alternative to the market for latest-generation AI servers."   *** About Bull Leveraging nearly a century of innovations, Bull is a global leader for High-Performance Computing, Artificial Intelligence and Quantum technologies with c.720m€ in revenue and 3,000 professionals operating in 32 countries. Built on an open, end-to-end and trusted approach, Bull designs, deploys and operates hardware, software and strategic services that unlock enterprise value, accelerate scientific research and advance society. Driven by world-class R&D, backed by 1,600 patents, manufacturing excellence and data sciences expertise, Bull enables nations and industries to fully control their AI and data and to drive progress for the benefit of the planet. For more information, please visit our website and follow us on Instagram, LinkedIn, X, and Youtube. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totalled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

15 June 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest electronics manufacturer, and Schneider Electric, a global energy technology leader, today announced a strategic collaboration to help define and scale the next generation of AI data centers. As AI adoption surges, the demands on digital infrastructure are being fundamentally reshaped. This collaboration brings together Foxconn’s unmatched expertise in advanced compute platforms, AI rack integration, and global manufacturing with Schneider Electric’s leadership in power systems, cooling, and energy management. Together, the companies aim to deliver integrated, ready-to-deploy solutions that enable customers to build and operate AI infrastructure with greater speed, efficiency, and predictability across regions. Production will begin later this year. “At the pace AI is evolving, the industry requires a new model for how infrastructure is designed, built, and delivered,” said Young Liu, Chairman of Foxconn. “By combining Foxconn’s strength in AI systems and global manufacturing with Schneider Electric’s deep expertise in power and energy, we are creating a path for customers to deploy AI capacity at scale—faster, smarter, and more sustainably.” "AI demand continues to accelerate, and as compute scales to keep pace, the energy behind it becomes a fundamental enabler,” said Olivier Blum, CEO of Schneider Electric. “If we want to scale AI responsibly, these systems must be connected. This is where energy intelligencebecomes essential. At Schneider Electric, we are advancing energy tech to build the most efficient and sustainable AI factories by bringing integrated power, cooling, and digital capabilities into AI data centers. Working with Foxconn, we are helping customers build capacity with real speed, resilience, and efficiency, as energy technology partners to an industry that is firmly entering the era of intelligence."  Through this collaboration, Foxconn and Schneider Electric will co-develop next-generation reference architectures for AI data centers. The partnership will also explore innovations in closed-loop energy optimization, modular power and cooling skids, and standardized design frameworks, creating repeatable, high-performance blueprints for AI factories worldwide. By aligning manufacturing excellence with energy intelligence, the two companies are setting the foundation for a new class of AI infrastructure that is scalable by design, efficient by default, and ready to meet the accelerating demands of the AI era.     About Schneider Electric Schneider Electric is a global energy technology leader, driving efficiency and sustainability by electrifying, automating, and digitalizing industries, businesses, and homes. Its technologies enable buildings, data centers, factories, infrastructure, and grids to operate as open, interconnected ecosystems, enhancing performance, resilience, and sustainability. The portfolio includes intelligent devices, software-defined architectures, AI-powered systems, digital services, and expert advisory. With 160,000 employees and one million partners in over 100 countries, Schneider Electric is consistently ranked among the world’s most sustainable companies.www.se.com    About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

New Taipei City, June 4, 2026 — Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) announced that Chairman Young Liu recently met with SK Group Chairman Chey Tae-won in Taipei to discuss the future development of the global AI industry, including potential collaboration in AI servers, AI data centers, and energy solutions, with the aim of strengthening next-generation AI infrastructure competitiveness. As the global AI industry continues to expand, demand for high-performance computing (HPC) and AI infrastructure is growing rapidly. Building a comprehensive and highly efficient AI ecosystem has become increasingly critical to driving innovation and accelerating the adoption of AI applications across industries. During the meeting, the two sides exchanged views on large-scale AI data center developments in Asia, evolving market demand, and potential industry collaboration models. Leveraging its strengths in AI server vertical integration, rack-scale system integration, advanced thermal technologies, and AI data center solutions, Foxconn aims to work closely with industry partners to advance the development of next-generation AI infrastructure. With its industry-leading technological capabilities, SK Group is accelerating the development of core technologies essential for the AI era. Going forward, SK will continue to strengthen its global competitiveness through innovation in next-generation AI memory technologies. In addition, the two companies discussed opportunities in robotics, energy management, and battery technologies. By combining SK Group’s expertise in energy and critical technologies with Foxconn’s strengths in global manufacturing, system integration, and AI application deployment, both parties look forward to exploring future collaboration opportunities and creating new value in the AI era.

New Taipei City, Taiwan, June 4, 2026 — Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced a strategic collaboration with Intel (NASDAQ: INTC) to jointly accelerate the development and deployment of next-generation AI infrastructure and intelligent computing platforms. By combining Intel’s strengths in processor architecture, silicon technologies, and software ecosystem with Foxconn’s global manufacturing scale, system integration expertise, and AI data center deployment capabilities, the two companies will explore comprehensive AI solutions spanning silicon, rack, system, and application layers. The collaboration also aims to accelerate the large-scale deployment of AI-driven technologies across edge and physical AI applications. Young Liu, Chairman and CEO of Hon Hai Technology Group, said: “AI is rapidly transforming industries and society worldwide. Through our ‘3+3+3’ strategy, Foxconn continues to advance key technologies including AI, semiconductors, and next-generation communications, while driving the development of our three core platforms: smart manufacturing, smart EV, and smart city. Our collaboration with Intel will combine the strengths of both companies across computing platforms, system integration, and global supply chain capabilities to jointly build next-generation AI infrastructure, Edge AI, and Physical AI ecosystems, accelerating the adoption of AI applications worldwide.” Lip-Bu Tan, Intel CEO, said “The rapid growth of AI—especially in inference and agentic workloads at scale—is redefining what modern computing must deliver. These demands require innovation across the full stack—from new silicon and chip design to rackscale systems and extending all the way to edge and physical AI deployments. Our collaboration with Foxconn brings together two innovation leaders with deep expertise in chip design, rack-scale solutions, and global systems integration. Together, we are accelerating the delivery of end-to-end platforms that unlock new capabilities and extend the impact of AI worldwide.” Under the collaboration framework, Intel and Foxconn will work together to scale AI-driven solutions by leveraging Intel’s computing platforms, silicon technologies, and software ecosystem together with Foxconn’s system integration capabilities, manufacturing expertise, and global customer reach. In the AI Rack domain, the two companies will explore the development and commercialization of rack-scale AI infrastructure solutions, including Intel Xeon-based CPU racks and AI accelerator architectures. The collaboration will also focus on advancing high-speed interconnect technologies, thermal and liquid cooling designs, system telemetry, and AI data center scalability to deliver high-performance, energy-efficient AI deployment solutions. In the Edge and Physical AI domain, Intel and Foxconn will jointly define next-generation Edge AI and Physical AI platform architectures, targeting emerging applications such as agentic AI, edge intelligence, and robotics. The collaboration will further promote and support diverse applications across smart manufacturing, smart cities, automotive, and robotics. In addition, the two companies will explore opportunities in design services, including custom ASICs, SoCs, and system integration solutions. By combining Intel’s end-to-end silicon capabilities with Foxconn’s comprehensive design and manufacturing ecosystem, the collaboration spans silicon, modules, and systems to address global market opportunities.

＊On Monday, June 1, 2026, Foxconn, Radiall and Thales laid the foundation stone for their future joint venture at Le Barp (Nouvelle-Aquitaine) as part of the Choose France 2026 Summit, in the presence of the French Minister Delegate to the Minister of the Economy, Finance, and Industrial, Energy and Digital Sovereignty, responsible for Industry, Mr. Sébastien Martin, the President of S Business Group for Hon Hai Technology Group (Foxconn), Dr. Bob Wei-Ming Chen, the Chairman and CEO of Radiall, Mr. Pierre Gattaz, the Chairman and CEO of Thales, Mr. Patrice Caine and the President of the Nouvelle-Aquitaine Region, Mr. Alain Rousset. ＊This company, called Tessalia Technology SAS, will be dedicated to Outsourced Semiconductor Assembly and Testing (OSAT). It aims to produce more than 50 million System in Package (SiP) components per year by 2033. ＊Within the framework of the EU chips act, this project represents a major step forward in strengthening the French and European semiconductor ecosystem, increasing its capacity for innovation, strategic autonomy and competitiveness.   One year after the announcement by the President of the French Republic, Mr. Emmanuel Macron, at the Choose France 2025 Summit, of the initiation of preliminary discussions among Hon Hai Technology Group (Foxconn), Radiall and Thales, the three companies laid the foundation stone of their future joint venture at Le Barp, near Bordeaux (Nouvelle-Aquitaine), on Monday, June 1, 2026. Le Barp is located in the heart of a rich academic and industrial ecosystem, close to the “Route des Lasers” and with the presence of numerous cleanrooms and a large pool of expertise in these fields.   Foxconn, the world’s largest electronics manufacturing service provider, Radiall, a leading French manufacturer of high-performance interconnect solutionsfor demanding industries, and Thales, a global leader in advanced technologies, have named this new company Tessalia, referring to the tiles of a mosaic (from the Latin “tessella”). They are combining their strengths to create, test and assemble advanced packaging solutions for electronic chips (Systems in Package, SiP) for aerospace, telecom infrastructure, automotive and medical sectors notably. Tessalia will use an innovative encapsulation technology aimed at developing ultra-high-density packaging. This will help simplify printed circuit boards (PCBs) and create smaller, lighter components, thereby improving their integration capability. This technology is emerging as a breakthrough in terms of yields and competitiveness for future products.   Tessalia aims to: -        Be a sovereign and competitive company to meet European needs in the field of semiconductor packaging in strategic sectors. Tessalia will have access to the technology from Foxconn under agreed licensing arrangements. -        Provide to its customers a single interface to manage the entire implementation of advanced packaging for electronic chips. This vertical approach simplifies the packaging stage and guarantees reduced cycle time. It also minimises the carbon footprint of the sector by reducing round trips with multiple suppliers distributed worldwide; -        Promote an autonomous and open player able to manage the European packaging market ecosystem.   Production is expected to start at the end of 2029 and to reach more than 50 million System in Package (SiP) components per year by 2033. This initiative aims to welcome other industrial players to support an investment that could exceed €250 million by 2033. Tessalia is expected to have 800 employees at full production.   In a context of surging demand for electronic equipment and artificial intelligence, and of geopolitical tensions disrupting global supply chains, semiconductor production has become a major strategic challenge, leading to a readjustment of the sector, an acceleration of production capacities and the development of new technologies.   “This new advanced capacity is a key sovereign asset for the European and French semiconductor industry. This project aligns perfectly with Radiall’s strategy, enabling the development of our next advanced connection solutions for demanding applications.” Pierre Gattaz, Chairman and CEO, Radiall   “This is not just a factory. It is a strategic platform for advanced manufacturing, semiconductor resilience, and future technologies in Europe. This project also supports Foxconn’s strategy of Build-Operate-Localize, which expands our global technology footprint through trusted partnerships.” Young Liu, Chairman, Foxconn   “The laying of this first stone today demonstrates our shared ambition, together with Radiall and Foxconn, to build an innovative and competitive European player in the advanced semiconductor packaging market, in a context of strong competition. Tessalia is part of a drive for independence and control over the value chain of all our electronic products.” Patrice Caine, Chairman and CEO, Thales   “I am delighted to welcome this strategic factory, which is crucial for our sovereignty in the electronics sector. It strengthens our regional ecosystem in this sector, which already represents 20,000 jobs. This project also rewards our long-standing efforts in reindustrialization, which have enabled us to become the leading region in France in terms of creating factories”. Alain Rousset, Président, Nouvelle-Aquitaine Region   About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us   About Radiall Founded in 1952, Radiall is a global manufacturer of advanced interconnect solutions, employing over 3,500 people worldwide. The company offers a comprehensive range of RF connectors and cables, coaxial switches, fiber optic and microwave components, multi-contact connectors and more, supported by an international presence ensuring close customer support.   About Thales Thales (Euronext Paris: HO) is a global leader in advanced technologies. Its portfolio of innovative products and services helps address several major challenges: sovereignty, security, sustainability and inclusion. The Group allocates €4.5 billion per year in Research & Development in key areas, particularly for critical environments, such as Artificial Intelligence, Cybersecurity, Quantum and Cloud technologies. Thales has more than 85,000 employees in 65 countries. In 2025, the Group generated sales of €22.1 billion.

Paris, France – 1 June, 2026 –Bull, a leader in advanced computing and AI, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technology solutions provider, announce a strategic collaboration to manufacture AI and Cloud infrastructure, from Europe to the global market. The partnership will combine Bull’s leadership in AI systems design, deployment and go-to-market, with Foxconn’s global manufacturing scale and supply chain capabilities,to enable the delivery of AI infrastructure solutions, including computing systems and related componentsleveraging Bull’s factory in Angers (France) and Foxconn’s factories in Pardubice (Czech Republic). Strengthening a resilient European supply chain for neo-cloud providers and AI factories This approach will address the growing needs of European AI Factories initiatives and neo-cloud providers to reinforce regional industrial capacity, while maintaining competitiveness in terms of cost, quality and time-to-market. The partnership focuses on European AI Factory and Infrastructure, closely aligning with the strategic vision for Sovereign AI. By anchoring the localized AI supply chain and computing capabilities in France, the initiative aims to serve as a key enabler for Europe’s sovereign AI ecosystem. To execute this strategic deployment in France, the project is expected to involve an initial investment exceeding EUR 120 million. At a time when artificial intelligence is becoming a critical economic infrastructure, industry analyses show that Europe remains significantly dependent on external markets for key components and technologies, exposing it to potential supply disruptions and limiting its industrial autonomy. Today, Europe accounts for around 8% of global semiconductor manufacturing capacity, according to ING, and holds less than 5% market share in several key AI infrastructure segments, including cloud and advanced computing platforms, as highlighted by McKinsey. Delivering next-generation AI servers and systems from France and the Czech Republic Bull and Foxconn will initially focus on the manufacturing enablement and industrialization of AI system, designed for demanding workloads such as AI training and inference. These systems will integrate advanced processors, including GPUs and other accelerators, together with high-performance memory, storage, scale out and scale up interconnect technologies. Designed as standalone systems or rack-level configurations, they will address the needs of a wide range of users – including enterprises, cloud and neo cloud service providers, research institutions and emerging AI factories, contributing to the expansion of a more structured and scalable AI ecosystem made within the European borders. From an industrial perspective, manufacturing and initial testing will be carried out in Foxconn’s facilities in the Czech Republic, before assembly, final integration and system-level validation at Bull’s factory in Angers (France). For Emmanuel Le Roux, CEO of Bull “This partnership with Foxconn accelerates our transformation by positioning Bull as a key European player in AI and cloud systems, leveraging Bull’s technical leadership in HPC, with the ability to deliver the most advanced infrastructure at scale and with competitive time to market. It marks an important step in the execution of our strategy to address neo-cloud providers and AI Factories across Europe, India, Latin America. By joining forces with Foxconn, we are taking a concrete step to deliver competitive AI infrastructure made in Europe while contributing to a more resilient digital ecosystem within Europe.” For Jesse Chao, Head of AI & Quantum at Foxconn: ”Leveraging our global manufacturing expertise and growing European footprint, we aim to provide scalable and high-quality production capabilities to support the deployment of Bull-led AI systems across the region. This collaboration, which advances building sovereign AI infrastructure in Europe, reflects our commitment to enabling a resilient and competitive AI supply chain for the European market.” About Bull Leveraging nearly a century of innovations, Bull is a global leader for High-Performance Computing, Artificial Intelligence and Quantum technologies with c.720m€ in revenue and 3,000 professionals operating in 32 countries. Built on an open, end-to-end and trusted approach, Bull designs, deploys and operates hardware, software and strategic services that unlock enterprise value, accelerate scientific research and advance society. Driven by world-class R&D, backed by 1,600 patents, manufacturing excellence and data sciences expertise, Bull enables nations and industries to fully control their AI and data and to drive progress for the benefit of the planet. For more information, please visit our website and follow us on Instagram, LinkedIn, X, and Youtube. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

Signals AI data center push into Europe with France's Bull1 June 2026, Taipei, Taiwan – Driving next generation artificial intelligence infrastructure and industrial transformation, Hon Hai Technology Group (Foxconn) (2317) is demonstrating its growing capabilities as a technology manufacturing platform service provider this week at COMPUTEX 2026, with its cutting-edge technology products supporting NVIDIA’s Vera Rubin super-computing platforms, and advances in data center build-out, robotics, healthcare and space. At the same time, Foxconn signaled its readiness to bring comprehensive AI data center solutions to Europe in a new strategic partnership with AI high-performance computing leader Bull. The French company will focus on system design and Foxconn will lead manufacturing. By combining technological expertise and supply chain strengths, the collaboration aims to accelerate the development of AI infrastructure in Europe. Amid strong global growth in the AI sector, Foxconn continues to deepen its AI server deployment and has become an indispensable partner within the global AI supply chain. The world’s largest electronics manufacturer is advancing from an AI server supplier to a “Token Factory” provider, further extending into full AI ecosystem integration. AI Infrastructure At COMPUTEX Booth M0120, Foxconn is showcasing its manufacturing and system integration capabilities for the NVIDIA Vera Rubin NVL72, along with the latest AI server and high-speed interconnect technologies, including: NVIDIA Groq 3 LPX NVIDIA Vera CPU platform NVIDIA HGX Rubin NVL8 platform NVIDIA MGX 2U and 4U modular systems   Foxconn is also a strategic partner in NVIDIA’s DSX Go-To-Market initiative, integrating digital twins, DSX SimReady assets, simulation validation, and modular data center design to accelerate deployment and optimize efficiency of next-generation AI factories. Agentic AI, Edge, and Next-Gen Connectivity This year, Foxconn, together with its partners, is showcasing its latest achievements in the fields of agentic AI, edge computing, and next-generation communications. In collaboration with Intel, exhibits demonstrate the AI Head Node Server, GNR-AP / CWF-AP Server, 1.6T OSFP 2xDR4 high-speed optical communication solution, and next-generation 5G DU Edge Server, further strengthening Foxconn's presence in AI data centers, high-speed networks, and next-generation communications infrastructure. In addition, Foxconn also showcased its collaboration with AMD, including the Ingrasys x AMD solution, the GB2281A platform, and the AMD Instinct™ MI350P PCIe Card. Space Data Centers Together with Ramon.Space, Foxconn is demonstrating related applications and next-generation communication technologies, including solutions such as NuComm, NuPod, NuBox, and edge computing devices. The efforts expand the application of AI infrastructure to fields such as space computing, low-Earth orbit satellite communications, and next-generation data centers. Optical and Core Components Also on display were key optical transmission technologies such as CPO (Co-Packaged Optics), 1.6T optical communication modules, CPC Cable to XPO, and ELSFP for CPO Switch Solution, as well as the latest hardware from L1-L12 manufacturing, including key components such as PCBs, water-cooled plates, and branch pipes, highlighting Foxconn’s vertical integration of AI servers and next-generation data center architecture. AI Compute Applications As one of the few NVIDIA Cloud Partners (NCP) in Taiwan with AI Factory infrastructure capabilities, the supercomputing center led by Foxconn’s Visionbay.ai integrates strengths in AI server manufacturing, thermal solutions, supply chain, and data centers, offering a GPU cloud platform for the AI agent ecosystem. This enables enterprises and developers to rapidly deploy, manage, and scale AI agent applications. AI Models and Agent Systems Running concurrently to COMPUTEX, the NVIDIA GTC Taipei will see Hon Hai Research Institute introduce FoxBrain 2.0, which integrates NVIDIA Nemotron Omni architecture and multimodal training. It evolves from “understanding” to “thinking, planning, and execution,” enabling Physical AI capabilities and extends to Smart Manufacturing, Smart EV, and Smart City, accelerating the implementation of industrial-grade embodied AI. Foxconn also introduced CoDoClaw, a clinical AI agent system built on NVIDIA NemoClaw. Centered around a “lobster agent,” it integrates multiple AI agent capabilities into medical workflows, enabling multi-agent collaboration in intelligent healthcare automation and serving as a “super clinical assistant” for physicians.   Robotics and Physical AI Foxconn’s Nurabot has completed field validation and is being deployed across multiple hospitals and long-term care settings. According to actual deployment data, Nurabot can perform 75 to 80 tasks per day and help reduce the workload of nursing staff by about 30% through clinical support work such as drug delivery and specimen transport. A collaborative surgical robot, that integrates multimodal perception, surgical scene understanding, and task reasoning, is jointly developed with Kawasaki Heavy Industries and partners, utilizing: NVIDIA Isaac for Healthcare (Agent-Ready Rheo Blueprint) NVIDIA Isaac GR00T Vision-Language-Action (VLA) architecture   On the manufacturing side, Foxconn demonstrated a wheeled humanoid robot solution integrating NVIDIA Isaac Teleop, MOMClaw, a teleoperation framework, and Physical AI technology. Applications include precision industrial assembly tasks such as pick-and-place, dual-arm collaboration, and force-controlled screw fastening. The system integrates vision, motion control, path planning, and force feedback, and supports development environments like Isaac Sim, Isaac Lab, and ROS 2, accelerating deployment and enhancing flexible manufacturing automation.

Integrating AI Agents, Robotics and Digital Twins to Accelerate the Rise of AI-Native Healthcare Infrastructure【Taipei, Taiwan — June 1, 2026】Foxconn (TWSE: 2317) today unveiled its latest Physical AI healthcare vision at COMPUTEX 2026 and NVIDIA GTC Taipei 2026, showcasing how AI agents, collaborative robotics, digital twins and multimodal medical AI are converging to transform real-world hospital operations and accelerate the emergence of next-generation smart hospitals. At a featured session held at the Taipei International Convention Center (TICC), Foxconn B Group President Barry Chiang joined Digital Health User Experience Design Director Alice Lin to present “Empowering Healthcare with Embodied Intelligence: From Nurabot Deployment to Smart Hospital Workflow Transformation.” The session highlighted how Foxconn is leveraging NVIDIA accelerated computing, simulation platforms and AI technologies to bring Physical AI from simulation into real-world clinical environments. As healthcare systems worldwide confront aging populations, workforce shortages and growing clinical complexity, Foxconn is advancing a next-generation healthcare AI ecosystem built upon AI infrastructure, multimodal medical models, embodied intelligence and clinical workflow orchestration. Rather than developing isolated AI tools, Foxconn is integrating AI systems capable of perceiving, reasoning and acting alongside healthcare professionals across hospital environments. Built upon NVIDIA’s “Five-Layer Cake” full-stack AI architecture spanning Energy, Infrastructure, Platform, Models and Applications, Foxconn showcased multiple healthcare innovations powered by technologies including NVIDIA Omniverse, NVIDIA Isaac, NVIDIA Holoscan, MONAI, NVIDIA Nemotron and NVIDIA NemoClaw. Together, these technologies enable the development of AI-native healthcare infrastructure designed to support increasingly autonomous, intelligent and real-world clinical operations.   Among the highlights was Nurabot, Foxconn’s nursing collaborative robot, which completed field validation last year and is now progressively expanding into hospitals and long-term care environments, including Taipei Veterans General Hospital, Tungs’ Taichung MetroHarbor Hospital, as well as overseas nursing education institutions. Real-world deployment data shows Nurabot can execute 75–80 tasks daily and help reduce nursing workload by approximately 30% through medication delivery, specimen transport and other clinical assistance workflows. Foxconn also showcased its scrub nurse collaborative robot, jointly developed with Kawasaki Heavy Industries, Taichung Veterans General Hospital and Yuan High-Tech. The system leverages the NVIDIA Isaac for Healthcare Agent-Ready Rheo Blueprint alongside NVIDIA Isaac GR00T Vision-Language-Action (VLA) architecture to enable multimodal perception, surgical scene understanding and intelligent task reasoning. Since its debut at GTC earlier this year, the project has achieved significant progress in simulation training and surgical workflow validation, with future clinical validation planned to accelerate the development of intelligent human-robot collaboration inside operating rooms. Another major showcase was Foxconn’s “Integrated Chemotherapy Drug Compounding and Delivery System for Smart Hospital Automation,” jointly developed with Taipei Veterans General Hospital, Kawasaki Heavy Industries, Yuyama Manufacturing and FARobot. Built upon real clinical workflows at Taipei Veterans General Hospital, the platform integrates chemotherapy drug compounding, autonomous intra-hospital transport and nursing delivery into a unified intelligent workflow. Powered by NVIDIA Omniverse, the system creates a virtual-physical integrated healthcare environment in which ChemoRo performs high-precision chemotherapy drug compounding, FARobot SMR30 autonomously transports medications within the hospital, and Nurabot supports last-mile delivery to nursing stations and patients. Together, the platform establishes a closed-loop workflow spanning compounding, transport and administration — helping improve operational efficiency, reduce manual workloads and enhance medication safety, traceability and process reliability in high-risk healthcare environments. Foxconn also introduced CoDoClaw, a clinical intelligent agent system built on NVIDIA NemoClaw, an open source blueprintfor deploying autonomous agents, like OpenClaw, with NVIDIA OpenShell for added privacy and security controls . Riding the rapid rise of agentic AI, CoDoClaw advances CoDoctor AI from standalone AI tools into a Multi-Agent Orchestration platform capable of coordinating AI agents across breast cancer screening, ECG analysis, fundus imaging and coronary artery analysis through a unified clinical interface. By connecting AI-driven lesion detection, appointment scheduling, report generation and follow-up management, CoDoClaw demonstrates how clinical AI agents can progressively support cross-department workflow orchestration and future healthcare automation. Foxconn envisions CoDoClaw as a foundational orchestration layer for future AI-native hospitals, enabling medical AI agents, robotics systems and clinical workflows to coordinate through shared operational intelligence. “Healthcare’s next transformation will not come from AI models alone, but from AI systems capable of perceiving, reasoning and acting in real-world clinical environments alongside healthcare professionals,” said Barry Chiang, President of Foxconn B Group and Digital Health. “Foxconn is building the next generation of intelligent healthcare through AI infrastructure, digital twins, embodied intelligence and ecosystem collaboration. We believe Physical AI will fundamentally reshape how hospitals operate and how care is delivered in the future.” Taiwan offers unique advantages for advancing smart healthcare and sovereign AI, combining world-class healthcare and national insurance systems, global leadership in semiconductors and AI infrastructure, and highly integrated clinical environments. Taiwan’s highly digitized healthcare ecosystem also provides an ideal real-world environment for validating Physical AI deployment and sovereign healthcare AI at scale. Through collaboration across government, hospitals and industry, Taiwan has the opportunity not only to address its own healthcare challenges, but also to help shape new operational models for intelligent healthcare worldwide. Moving forward, Foxconn will continue working with NVIDIA and ecosystem partners through the Taiwan Digital Health Alliance (HiMEDt) to accelerate Physical AI deployment across hospitals, long-term care and home healthcare environments, helping position Taiwan as a global showcase for next-generation smart healthcare transformation.