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Foxconn and SHARP Sign Strategic Memorandum of Understanding Advancing the “3+3+3” Strategy in Japan and Global Markets
2026/06/24
3+3+3

Osaka, Japan, June 24, 2026 — Hon Hai Technology Group (Foxconn) (TWSE: 2317) today announced the signing of a Strategic Memorandum of Understanding (MOU) with SHARP Corporation (TYO: 6753). Through a clearly defined collaboration framework and communication mechanism, the two companies will leverage Foxconn’s technology capabilities, global manufacturing footprint, supply chain expertise, and investment ecosystem established under its “3+3+3” strategy, together with SHARP’s brand strength, market channels, and customer service network to explore investment opportunities and other forms of collaboration, accelerating new business development and market expansion.


The MOU covers a broad range of strategic areas, including AI infrastructure and solutions, energy and ESG-related applications, robotics and intelligent automation systems, next-generation communications technologies, and smart city initiatives. The two companies will jointly develop innovative products and services to address evolving market needs.


As a priority initiative, the companies will evaluate the establishment of a “3+3+3” Joint R&D Platform, combining SHARP’s new business initiatives with Foxconn’s capabilities in AI, energy, robotics, electric vehicles, and next-generation communications. The platform will support joint R&D, proof-of-concept validation, product development, and commercialization efforts.


The two companies will also evaluate a business development collaboration platform to accelerate new business deployment by combining SHARP’s market strengths with Foxconn’s manufacturing capabilities, supply chain resources, and global partner network.


In AI infrastructure, the companies will build on SHARP’s AI server initiative and explore AI server products and solutions under the SHARP brand, integrating product supply, maintenance services, deployment support, and related business models to meet growing demand for high-performance computing and AI applications.


Young Liu, Chairman of Hon Hai Technology Group (Foxconn), said:

“As an important affiliated company of the Hon Hai Technology Group (Foxconn), SHARP possesses strong brand value and a solid market foundation. Through this collaboration framework, we look forward to creating synergies between our organizations and developing new business models in growth sectors such as AI, energy, and robotics, further enhancing SHARP’s corporate value and the overall competitiveness of the Foxconn Group.”


Tetsuji Kawamura, President and Chief Executive Officer of SHARP Corporation, said:

“SHARP has built a strong presence in Japan and global markets. Through this collaboration, we look forward to leveraging Foxconn’s strengths in technological innovation and global supply chain management to drive new business development and create new growth opportunities.”


Looking ahead, SHARP and Foxconn will use this MOU as a foundation for future collaboration. Guided by market demand and industry trends, the two companies will continue to advance collaborative initiatives and pursue opportunities that create long-term value.

Photo Caption: Witnessed by Foxconn Chairman Young Liu (center), Foxconn and SHARP signed a Strategic MOU. (Photo courtesy of Foxconn)


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